Kinetics of electroless deposition: The copper-dimethylamine borane system

Langmuir

Volumn 26, Issue 12, 2010, Pages 10334-10340

  Plana, Daniela ^a   Campbell, Andrew I ^a   Patole, Samson N ^a   Shul, Galyna ^a   Dryfe, Robert A W ^a  

^a UNIVERSITY OF MANCHESTER   (United Kingdom)

Author keywords

[No Author keywords available]

Indexed keywords

COPPER DEPOSITION; DIMETHYLAMINE BORANE; DIMETHYLAMINE BORANES; DIRECT MEASUREMENT; ELECTROCHEMICAL STRIPPING; ELECTROLESS BATH; ELECTROLESS DEPOSITION; ELECTROLESS PROCESS; GALVANIC CELLS; HALF-REACTIONS; INITIAL STAGES; KINETIC EFFECT; KINETIC STUDY; SIDE REACTIONS;

ATOMIC FORCE MICROSCOPY; COPPER; DEPOSITION RATES; GOLD COATINGS; GOLD DEPOSITS; KINETIC THEORY;

COPPER DEPOSITS;

EID: 79954584017     PISSN: 07437463     EISSN: 15205827     Source Type: Journal    
DOI: 10.1021/la100390x     Document Type: Article

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