Accelerating effect of ammonia on electroless copper deposition in alkaline formaldehyde-containing solutions

Journal of Electroanalytical Chemistry

Volumn 600, Issue 1, 2007, Pages 6-12

  Vaškelis, Algirdas ^a   Jačiauskiene, Jane ^a   Stalnioniene, Irena ^a   Norkus, Eugenijus ^a  

^a CENTER FOR PHYSICAL SCIENCES AND TECHNOLOGY   (Lithuania)

Author keywords

Ammonia; Electroless copper deposition; Formaldehyde anodic oxidation; Real surface area; Solution equilibria

Indexed keywords

CATALYST ACTIVITY; DIFFERENTIAL THERMAL ANALYSIS; ELECTROLESS PLATING; FORMALDEHYDE; OXIDATION; SURFACE ROUGHNESS;

ELECTROLESS COPPER DEPOSITION; FORMALDEHYDE ANODIC OXIDATION; REAL SURFACE AREA; SOLUTION EQUILIBRIA;

AMMONIA;

EID: 33846222001     PISSN: 15726657     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jelechem.2006.03.005     Document Type: Article

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