A versatile approach to selective and inexpensive copper patterns using polyelectrolyte multilayer coatings

Thin Solid Films

Volumn 515, Issue 4, 2006, Pages 2347-2352

  Hendricks, Troy R ^a   Lee, Ilsoon ^a  

^a Michigan State University   (United States)

Author keywords

Metallization; Microcontact printing; Multilayers; Polyelectrolyte

Indexed keywords

ATOMIC FORCE MICROSCOPY; BIMETALS; MICROELECTRONICS; POLYELECTROLYTES; X RAY SPECTROSCOPY;

BIMETALLIC PATTERNS; MICROCONTACT PRINTING; THREE DIMENSIONAL METAL ARCHITECTURES;

COPPER;

EID: 33750814396     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2006.04.035     Document Type: Article

References (39)

1. Forrest S.R. Nature 428 (2004) 911
2. Baude P.F., Ender D.A., Haase M.A., Kelley T.W., Muyres D.V., and Theiss S.D. App. Phys. Lett. 82 (2003) 3964
3. Smits J.H.A., Meskers S.C.J., Janssen R.A.J., Marsman A.W., and de Leeuw D.M. Adv. Mater. 17 (2005) 1169
4. Hidber P.C., Helbig W., Kim E., and Whitesides G.M. Langmuir 12 (1996) 1375
5. Moran C.E., Radloff C., and Halas N.J. Adv. Mater. 15 (2003) 804
6. Geissler M., Kind H., Schmidt-Winkel P., Michel B., and Delamarche E. Langmuir 19 (2003) 6283
7. Carmichael T.B., Vella S.J., and Afzali A. Langmuir 20 (2004) 5593
8. Kind H., Geissler M., Schmid H., Michel B., Kern K., and Delamarche E. Langmuir 16 (2000) 6367
9. Bittner A.M., Wu X.C., and Kern K. Adv. Funct. Mater. 12 (2002) 432
10. Wu X.C., Bittner A.M., and Kern K. Langmuir 18 (2002) 4984
11. Xia Y.N., and Whitesides G.M. Angew. Chem., Int. Ed. Engl. 37 (1998) 551
12. Geissler M., and Xia Y.N. Adv. Mater. 16 (2004) 1249
13. Hammond P.T. Adv. Mater. 16 (2004) 1271
14. In: Mallory G.O., and Hajdu J.B. (Eds). Electroless Plating: Fundamentals and Applications (1990), American Electroplaters and Surface Finishers Society, Orlando, FL
15. Lee I., Hammond P.T., and Rubner M.F. Chem. Mater. 15 (2003) 4583
16. Knez M., Sumser M., Bittner A.M., Wege C., Jeske H., Martin T.P., and Kern K. Adv. Funct. Mater. 14 (2004) 116
17. Decher G. Science 277 (1997) 1232
18. Zhai L., Cebeci F.C., Cohen R.E., and Rubner M.F. Nano Lett. 4 (2004) 1349
19. Ahn J.S., Hammond P.T., Rubner M.F., and Lee I. Colloids Surf., A Physicochem. Eng. Asp. 259 (2005) 45
20. Mamedov A.A., Kotov N.A., Prato M., Guldi D.M., Wicksted J.P., and Hirsch A. Nat. Mater. 1 (2002) 190
21. Mamedov A.A., Belov A., Giersig M., Mamedova N.N., and Kotov N.A. J. Am. Chem. Soc. 123 (2001) 7738
22. Wang T.C., Cohen R.E., and Rubner M.F. Adv. Mater. 14 (2002) 1534
23. Kidambi S., and Bruening M.L. Chem. Mat. 17 (2005) 301
24. Kumar A., Biebuyck H.A., and Whitesides G.M. Langmuir 10 (1994) 1498
25. Xia Y.N., Mrksich M., Kim E., and Whitesides G.M. J. Am. Chem. Soc. 117 (1995) 9576
26. Kidambi S., Chan C., and Lee I. J. Am. Chem. Soc. 126 (2004) 4697
27. Zheng H.P., Rubner M.F., and Hammond P.T. Langmuir 18 (2002) 4505
28. Jiang X.P., Zheng H.P., Gourdin S., and Hammond P.T. Langmuir 18 (2002) 2607
29. Lee I., Ahn J.S., Hendricks T.R., Rubner M.F., and Hammond P.T. Langmuir 20 (2004) 2478
30. Kohli N., Dvornic P.R., Kaganove S.N., Worden R.M., and Lee I. Macromol. Rapid Commun. 25 (2004) 935
31. Park J., and Hammond P.T. Adv. Mater. 16 (2004) 520
32. Kohli N., Worden R.M., and Lee I. Chem. Commun. 3 (2005) 316
33. Wang T.C., Chen B., Rubner M.F., and Cohen R.E. Langmuir 17 (2001) 6610
34. Guo T.F., Chang S.C., Pyo S., and Yang Y. Langmuir 18 (2002) 8142
35. Xia Y.N., and Whitesides G.M. Annu. Rev. Mater. Sci. 28 (1998) 153
36. Clark S.L., and Hammond P.T. Adv. Mater. 10 (1998) 1515
37. Jagannathan R., and Krishnan M. IBM J. Res. Develop. 37 (1993) 117
38. Kim J.J., Kim S.K., Lee C.H., and Kim Y.S. J. Vac. Sci. Technol., B 21 (2003) 33
39. McNally P.J., Kanatharana J., Toh B.H.W., McNeill D.W., Danilewsky A.N., Tuomi T., Knuuttila L., Riikonen J., Toivonen J., and Simon R. J. Appl. Phys. 96 (2004) 7596