Direct patterning of copper on polyimide by site-selective surface modification via a screen-printing process

ChemPhysChem

Volumn 12, Issue 6, 2011, Pages 1143-1147

  Su, Wei ^a   Li, Peiyuan ^b   Yao, Libei ^a   Yang, Fang ^a   Liang, Lifang ^a   Chen, Juan ^a  

^a GUANGXI TEACHERS EDUCATION UNIVERSITY   (China)

^b GUANGXI UNIVERSITY OF CHINESE MEDICINE   (China)

Author keywords

copper; interfaces; nanoparticles; surface chemistry; thin films

Indexed keywords

ATOMIC FORCE MICROSCOPY; COPPER METALLURGY; COSTS; ELECTRONICS INDUSTRY; EXCITONS; INTERFACES (MATERIALS); METAL COMPLEXES; METALLIC FILMS; NANOPARTICLES; POLYIMIDES; POTASSIUM HYDROXIDE; PRINTING PRESSES; SCREEN PRINTING; SUBSTRATES; SURFACE CHEMISTRY; THIN FILMS;

COPPER METALLIZATION; DIRECT-PATTERNING; METALLIC COPPER; POLYIMIDE SUBSTRATE; PROCESSING TECHNIQUE; SCANNING ELECTRONIC MICROSCOPY (SEM); SCREEN-PRINTING PROCESS; TRANSMISSION ELECTRONIC MICROSCOPIES;

COPPER;

EID: 79953900826     PISSN: 14394235     EISSN: 14397641     Source Type: Journal    
DOI: 10.1002/cphc.201100040     Document Type: Article

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