Realization of three-dimensional Si and SiO2 nanowall structures using reactive ion etching

Journal of Microelectromechanical Systems

Volumn 20, Issue 2, 2011, Pages 353-354

  Azimi, S ^a   Sandoughsaz, A ^a   Mohajerzadeh, S ^a  

^a UNIVERSITY OF TEHRAN   (Iran)

Author keywords

Micromachining; nanotechnology; optical device fabrication; plasma etching

Indexed keywords

DEEP REACTIVE ION ETCHING; ETCHING STEP; MASKING LAYERS; NANOWALLS; OPTICAL DEVICE FABRICATION; SILICON STRUCTURES; SILICON SUBSTRATES;

COMPOSITE MICROMECHANICS; MICROMACHINING; NANOTECHNOLOGY; OPTICAL DEVICES; OPTICAL INSTRUMENTS; PASSIVATION; PLASMA ETCHING; SILICON COMPOUNDS; SILICON OXIDES; THREE DIMENSIONAL;

REACTIVE ION ETCHING;

EID: 79953740849     PISSN: 10577157     EISSN: None     Source Type: Journal    
DOI: 10.1109/JMEMS.2011.2105248     Document Type: Article

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