Growth and transport properties of oriented bismuth telluride films

Journal of Alloys and Compounds

Volumn 509, Issue 18, 2011, Pages 5683-5687

  Deng, Yuan ^a   Liang, Hui Min ^a   Wang, Yao ^a   Zhang, Zhi Wei ^a   Tan, Ming ^a   Cui, Jiao Lin ^b  

^a BEIHANG UNIVERSITY   (China)

^b NINGBO UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

Crystal growth; Nanostructured materials; Thermoelectric materials; Thin films

Indexed keywords

BISMUTH TELLURIDE; BISMUTH TELLURIDE THIN FILMS; ELECTRICAL CONDUCTIVITY; FORMATION MECHANISM; IN-PLANE; LAYERED NANOSTRUCTURE; LAYERED STRUCTURES; NANO-STRUCTURED; OPTIMAL MORPHOLOGY; RADIO FREQUENCY MAGNETRON SPUTTERING; SEM; SUBSTRATE TEMPERATURE; THERMOELECTRIC MATERIAL;

BISMUTH; BISMUTH COMPOUNDS; CARRIER CONCENTRATION; CARRIER MOBILITY; CRYSTAL GROWTH; CRYSTALLIZATION; ELECTRIC CONDUCTIVITY; GRAIN BOUNDARIES; METAL ANALYSIS; MICROSTRUCTURE; MORPHOLOGY; NANOSTRUCTURED MATERIALS; SCANNING ELECTRON MICROSCOPY; THERMAL CONDUCTIVITY; THERMOELECTRIC EQUIPMENT; THERMOELECTRICITY; THIN FILMS; X RAY DIFFRACTION;

NANOSTRUCTURES;

EID: 79953268012     PISSN: 09258388     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.jallcom.2011.02.123     Document Type: Article

References (26)

1. L.D. Chen, X.Y. Li, W. Jiang, D.G. Zhao, and L. He J. Alloys Compd. 477 2009 425 431
2. M. Takashiri, S. Tanaka, M. Takiishi, M. Kihara, K. Miyazaki, and H. Tsukamoto J. Alloys Compd. 462 2008 351 355
3. B.C. Sales Science 295 2002 1248 1249
4. M. Fardy, A.I. Hochbaum, J. Goldberger, M.M. Zhang, and P.D. Yang Adv. Mater. 19 2007 3047 3051
5. L.D. Hicks, T.C. Harman, X. Sun, and M.S. Dresselhaus Phys. Rev. B 53 1996 10493 10496
6. W.J. Xie, X.F. Tang, Y.G. Yan, Q.J. Zhang, and T.M. Tritt J. Appl. Phys. 105 2009 113713
7. Z. Wang, F.Q. Wang, H. Chen, L. Zhu, H.J. Yu, and X.Y. Jian J. Alloys Compd. 492 2010 50 53
8. Q. Zhao, and Y.G. Wang J. Alloys Compd. 497 2010 57 61
9. L.N. Zhou, X.B. Zhang, X.B. Zhao, C.X. Sun, and Q. Niu J. Alloys Compd. 502 2010 329 332
10. R. Venkatasubramanian, E. Siivola, T. Colpitts, and B. O'Quinn Nature 413 2001 597 602
11. J. Walachová R. Zeipl, J. Zelinka, and V. Malina Appl. Phys. Lett. 87 2005 081902
12. G.J. Snyder, J.R. Lim, C.K. Huang, and J.P. Fleurial Nat. Mater. 2 2003 528 531
13. G.E. Bulman, E. Siivola, B. Shen, and R. Venkatasubramanian Appl. Phys. Lett. 89 2006 122117
14. A. Li Bassi, A. Bailini, C.S. Casari, F. Donati, A. Mantegazza, M. Passoni, V. Russo, and C.E. Bottani J. Appl. Phys. 105 2009 124307
15. L.Q. Qiu, J. Zhou, X. Cheng, and R. Ahuja J. Phys. Chem. Solids 71 2010 1131 1136
16. X.K. Duan, and Y.Z. Jiang Appl. Surf. Sci. 256 2010 7365 7370
17. D. Teweldebrhan, V. Goyal, M. Rahman, and A.A. Balandin Appl. Phys. Lett. 96 2010 053107
18. D. Teweldebrhan, V. Goyal, and A.A. Balandin Nano Lett. 10 2010 1209
19. V. Goyal, D. Teweldebrhan, and A.A. Balandin Appl. Phys. Lett. 97 2010 133117
20. C.N. Liao, Y.C. Wang, and H.S. Chu J. Appl. Phys. 104 2008 104312
21. D.H. Kim, E. Byon, G.H. Lee, and S. Cho Thin Solid Films 510 2006 148 153
22. F.R. Yu, J.J. Zhang, D.L. Yu, J.L. He, Z.Y. Liu, B. Xu, and Y.J. Tian J. Appl. Phys. 105 2009 094303
23. D.H. Kim, and T. Mitani J. Alloys Compd. 399 2005 14 19
24. H. Huang, W. Luan, and S. Tu Thin Solid Films 517 2009 3731 3734
25. D.H. Kim, and G. Lee Mater. Sci. Eng. B 131 2006 106 110
26. Y.C. Jung, J.H. Kim, S.H. Suh, B.K. Ju, and J.S. Kim J. Cryst. Growth 290 2006 441 445