Investigation of the effects of reflow profile parameters on lead-free solder bump volumes and joint integrity

AIP Conference Proceedings

Volumn 1315, Issue , 2010, Pages 639-644

  Amalu, E H ^a   Lui, Y T ^b   Ekere, N N ^a   Bhatti, R S ^a   Takyi, G ^c  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^c KWAME NKRUMAH UNIVERSITY OF SCIENCE AND TECHNOLOGY   (Ghana)

Author keywords

Flip Chip; Lead free Soldering; Miniaturization; Reflow Profile; Solder Joint Integrity

Indexed keywords

EID: 79952540129     PISSN: 0094243X     EISSN: 15517616     Source Type: Conference Proceeding    
DOI: 10.1063/1.3552519     Document Type: Conference Paper

References (10)

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