Optimisation of lead free solders reflow profile

ISSE 2006 - 29th International Spring Seminar on Electronics Technology: Nano Technologies for Electronics Packaging, Conference Proceedings

Volumn , Issue , 2006, Pages 459-464

  Pietriková, Alena ^a   Livovský, L'ubomír ^a   Urbančík, Ján ^a   Bučko, Radoslav ^a  

^a TECHNICAL UNIVERSITY OF KO ICE   (Slovakia)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRIC PROPERTIES; ELECTRONIC EQUIPMENT MANUFACTURE; ELECTRONICS PACKAGING; INDUSTRIAL ENGINEERING; LEAD; MECHANICAL PROPERTIES; SOLDERING; SOLDERING ALLOYS; SPRINGS (COMPONENTS); STRUCTURAL PROPERTIES; TECHNOLOGY; WELDING;

(+ MOD 2N) OPERATION; (PL) PROPERTIES; CONFERENCE PROCEEDINGS; ELECTRICAL (ELECTRONIC) PROPERTIES; ELECTRONICS TECHNOLOGY; INTERNATIONAL (CO); KEY VARIABLES; LEAD-FREE SOLDER (SN-3.5AG-0.5CU); MANUFACTURING PROCESSES; NANO TECHNOLOGIES; OPTIMISATION; PROCESS WINDOWS; PRODUCT YIELDS; SAC ALLOYS; SOLDER JOINTS; SOLDER PASTES; SOLDER REFLOWING; VAPOR-PHASE SOLDERING;

BRAZING;

EID: 46449116510     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/ISSE.2006.365149     Document Type: Conference Paper

References (2)

1. M. McCormack, S. Jin, G. W. Kammlott, and H. S. Chen: New Pb-free solder alloy with superior mechanical properties, Appl. Phys. Lett. 63 (I), 5 July, 1993, p 15-17
2. W. Jang, A. P. De Silva, T. Y. Lee, J. K. Lin, and D. R. Frear: Direct correlation between microstructure and mechanical tensile properties in Pb-free solders and eutectic SnPb solder for flip chip technology, Applied physics, Letter Vol. 79, No 4, 2001, p 482-484