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Volumn 26, Issue 3, 2011, Pages 467-474

Effects of the crystallographic orientation of Sn on the electromigration of Cu/Sn-Ag-Cu/Cu ball joints

Author keywords

[No Author keywords available]

Indexed keywords

APPLIED CURRENT; BALL JOINTS; CIRCUIT FAILURES; CRYSTALLOGRAPHIC ORIENTATIONS; CU ATOMS; ELECTROMIGRATION BEHAVIOR; ELECTRON FLOW; INTERMETALLIC COMPOUNDS; INTERSTITIAL DIFFUSION; MICROSTRUCTURAL CHANGES; SN GRAINS; SOLDER BALLS; SOLDER BUMP; TEST VEHICLE;

EID: 79952475601     PISSN: 08842914     EISSN: None     Source Type: Journal    
DOI: 10.1557/jmr.2010.86     Document Type: Article
Times cited : (41)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.