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Volumn 56, Issue 3, 2011, Pages 322-329

The effectiveness of thermal treatment for development of conductive metalized aramid fiber using supercritical fluid carbon dioxide - Fiber-metal adhesive strength improvement

Author keywords

Electroless plating; Poly (p phenylene terephthalamide); Supercritical carbon dioxide

Indexed keywords

ADHESIVE STRENGTH; ARAMID FIBER; COPPER LAYER; DECOMPOSITION REACTION; DISSOCIATION REACTIONS; ELECTROLESS COPPER PLATING; ELECTRON IONIZATION MASS SPECTROMETRY; FIBER SURFACE; MASS SPECTRA; METAL ADHESION; P-PHENYLENE; PD COMPLEX; PD PARTICLE; POLYMER SUBSTRATE; POST THERMAL TREATMENT; REACTION TEMPERATURE; SUPERCRITICAL CARBON DIOXIDE; SUPERCRITICAL CONDITION; SUPERCRITICAL FLUID CARBON DIOXIDES; TEREPHTHALAMIDES; THERMAL TREATMENT; X-RAY PHOTOELECTRONS; XPS;

EID: 79952314257     PISSN: 08968446     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.supflu.2010.10.011     Document Type: Conference Paper
Times cited : (27)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.