-
2
-
-
32544442209
-
MALDI-TOF MS study of poly(p-phenylene terephthalamide) fibers
-
DOI 10.1021/ma051637b
-
A.P. Gies, D.M. Hercules, S.T. Ellison, and W.K. Nonidez MALDI-TOF MS study of poly(p-phenylene terephthalamide) fibers Macromolecules 39 2006 941 947 (Pubitemid 43235649)
-
(2006)
Macromolecules
, vol.39
, Issue.3
, pp. 941-947
-
-
Gies, A.P.1
Hercules, D.M.2
Ellison, S.T.3
Nonidez, W.K.4
-
3
-
-
0038269811
-
Application of emulsion of dense carbon dioxide in electroplating solution with nonionic surfactants for nickel electroplating
-
DOI 10.1016/S0257-8972(03)00734-5
-
H. Yoshida, M. Sone, A. Mizushima, H. Yan, H. Wakabayashi, K. Abe, X.T. Tao, S. Ichihara, and S. Miyata Application of emulsion of dense carbon dioxide in electroplating solution with nonionic surfactants for nickel electroplating Surface and Coatings Technology 173 2003 285 292 (Pubitemid 36821717)
-
(2003)
Surface and Coatings Technology
, vol.173
, Issue.2-3
, pp. 285-292
-
-
Yoshida, H.1
Sone, M.2
Mizushima, A.3
Yan, H.4
Wakabayashi, H.5
Abe, K.6
Tao, X.T.7
Ichihara, S.8
Miyata, S.9
-
4
-
-
2142819489
-
The effects of dense carbon dioxide on nickel plating using emulsion of carbon dioxide in electroplating solution
-
DOI 10.1016/j.surfcoat.2003.07.006, PII S0257897203008855
-
H. Yan, M. Sone, N. Sato, S. Ichihara, and S. Miyata The effects of dense carbon dioxide on nickel plating using emulsion of carbon dioxide in electroplating solution Surface and Coatings Technology 182 2004 329 334 (Pubitemid 38537247)
-
(2004)
Surface and Coatings Technology
, vol.182
, Issue.2-3
, pp. 329-334
-
-
Yan, H.1
Sone, M.2
Sato, N.3
Ichihara, S.4
Miyata, S.5
-
5
-
-
0348011346
-
New electroplating method of nickel in emulsion of supercritical carbon dioxide and electroplating solution to enhance uniformity and hardness of plated film
-
H. Yoshida, M. Sone, H. Wakabayashi, H. Yan, K. Abe, X.T. Tao, A. Mizushima, S. Ichihara, and S. Miyata New electroplating method of nickel in emulsion of supercritical carbon dioxide and electroplating solution to enhance uniformity and hardness of plated film Thin Solid Films 446 2004 194 199
-
(2004)
Thin Solid Films
, vol.446
, pp. 194-199
-
-
Yoshida, H.1
Sone, M.2
Wakabayashi, H.3
Yan, H.4
Abe, K.5
Tao, X.T.6
Mizushima, A.7
Ichihara, S.8
Miyata, S.9
-
6
-
-
33748422643
-
A new method of producing conductive aramid fibers using supercritical carbon dioxide
-
DOI 10.1016/j.surfcoat.2005.12.021, PII S025789720501368X
-
X. Zhao, K. Hirogaki, I. Tabata, S. Okubayasi, and T. Hori A new method of producing conductive aramid fiber using supercritical carbon dioxide Surface and Coatings Technology 201 2006 628 636 (Pubitemid 44340764)
-
(2006)
Surface and Coatings Technology
, vol.201
, Issue.3-4
, pp. 628-636
-
-
Zhao, X.1
Hirogaki, K.2
Tabata, I.3
Okubayashi, S.4
Hori, T.5
-
9
-
-
0028374178
-
Spectroscopic analysis in situ monitoring of impregnation and extraction of polymer films and powders using supercritical fluids
-
S.M. Howdle, J.M. Ramsay, and I. Cooper Spectroscopic analysis in situ monitoring of impregnation and extraction of polymer films and powders using supercritical fluids Journal of Polymer Science, Part B: Polymer Physics 32 1994 541 549
-
(1994)
Journal of Polymer Science, Part B: Polymer Physics
, vol.32
, pp. 541-549
-
-
Howdle, S.M.1
Ramsay, J.M.2
Cooper, I.3
-
10
-
-
29144504424
-
Nanomaterials and supercritical fluids
-
DOI 10.1016/j.supflu.2005.08.003, PII S089684460500166X
-
E. Reverchon, and R. Adami Nanomaterials and supercritical fluids Journal of Supercritical Fluids 37 2006 1 22 (Pubitemid 41814765)
-
(2006)
Journal of Supercritical Fluids
, vol.37
, Issue.1
, pp. 1-22
-
-
Reverchon, E.1
Adami, R.2
-
12
-
-
33750364203
-
Influence of solvents on the formation of Pd and PdO nanoparticles in SBA-15
-
DOI 10.1016/j.mseb.2006.08.028, PII S0921510706004776
-
S.-S. Lee, H.-I. Park, B.-K. Park, and S.-H. Byeon Influence of solvents on the formation of Pd and PdO nanoparticles in SBA-15 Materials Science and Engineering B 135 2006 20 24 (Pubitemid 44633641)
-
(2006)
Materials Science and Engineering B: Solid-State Materials for Advanced Technology
, vol.135
, Issue.1
, pp. 20-24
-
-
Lee, S.-S.1
Park, H.-I.2
Park, B.-K.3
Byeon, S.-H.4
-
13
-
-
41849117714
-
2 emulsion
-
DOI 10.1016/j.surfcoat.2008.01.037, PII S0257897208001023
-
2 emulsion Surface and Coatings Technology 202 2008 3921 3926 (Pubitemid 351494498)
-
(2008)
Surface and Coatings Technology
, vol.202
, Issue.16
, pp. 3921-3926
-
-
Woo, B.-H.1
Sone, M.2
Shibata, A.3
Ishiyama, C.4
Masuda, K.5
Yamagata, M.6
Endo, T.7
Hatsuzawa, T.8
Higo, Y.9
-
15
-
-
74849125914
-
2 emulsion
-
2 emulsion Surface and Coatings Technology 204 2010 1785 1792
-
(2010)
Surface and Coatings Technology
, vol.204
, pp. 1785-1792
-
-
Woo, B.-H.1
Sone, M.2
Shibata, A.3
Ishiyama, C.H.4
Edo, S.5
Tokita, M.6
Watanabe, J.7
Higo, Y.8
-
16
-
-
29244446786
-
Effect of surface roughness on the adhesion properties of Cu/Cr films on polyimide substrate treated by inductively coupled oxygen plasma
-
DOI 10.1016/j.surfcoat.2005.05.021, PII S0257897205006249
-
S.H. Kim, S.W. Na, N.-E. Lee, Y.W. Nam, and Y.-H. Kim Effect of surface roughness on the adhesion properties of Cu/Cr films on polyimide substrate treated by inductively coupled oxygen plasma Surface and Coatings Technology 200 2005 2072 2079 (Pubitemid 41819145)
-
(2005)
Surface and Coatings Technology
, vol.200
, Issue.7
, pp. 2072-2079
-
-
Kim, S.H.1
Na, S.W.2
Lee, N.-E.3
Nam, Y.W.4
Kim, Y.-H.5
-
17
-
-
36048968863
-
Adhesion energy of Cu/polyimide interface in flexible printed circuits
-
DOI 10.1016/j.surfcoat.2007.07.061, PII S0257897207008316, ICMCTF 2007
-
S. Kamiya, H. Furuta, and M. Omiya Adhesion energy of Cu/polyimide interface in flexible printed circuits Surface and Coatings Technology 202 2007 1084 1088 (Pubitemid 350082279)
-
(2007)
Surface and Coatings Technology
, vol.202
, Issue.4-7
, pp. 1084-1088
-
-
Kamiya, S.1
Furuta, H.2
Omiya, M.3
-
18
-
-
33751041369
-
The effects of ion beam treatment on the interfacial adhesion of Cu/polyimide system
-
M.-H. Kim, and K.-W. Lee The effects of ion beam treatment on the interfacial adhesion of Cu/polyimide system Metals and Materials International 12 5 2006 425 433 (Pubitemid 44758213)
-
(2006)
Metals and Materials International
, vol.12
, Issue.5
, pp. 425-433
-
-
Kim, M.-H.1
Lee, K.-W.2
-
19
-
-
72549084331
-
Interfacial adhesion characteristics between electroless-plated Ni and polyimide films modified by alkali surface pretreatment
-
K.-J. Min, S.-C. Park, K.H. Lee, Y. Jeong, and Y.-B. Park Interfacial adhesion characteristics between electroless-plated Ni and polyimide films modified by alkali surface pretreatment Journal of Electronic Materials 38 12 2009 2455 2460
-
(2009)
Journal of Electronic Materials
, vol.38
, Issue.12
, pp. 2455-2460
-
-
Min, K.-J.1
Park, S.-C.2
Lee, K.H.3
Jeong, Y.4
Park, Y.-B.5
-
20
-
-
32644464683
-
Plasma surface modification of polyimide films by air glow discharge for copper metallization on microelectronic flex substrates
-
DOI 10.1016/j.surfcoat.2004.11.031, PII S0257897204011843
-
Y.-S. Lin, H.-M. Liu, and C.-L. Chen Plasma surface modification of polyimide films by air glow discharge for copper metallization on microelectronic flex substrates Surface and Coatings Technology 200 2006 3775 3785 (Pubitemid 43246060)
-
(2006)
Surface and Coatings Technology
, vol.200
, Issue.12-13
, pp. 3775-3785
-
-
Lin, Y.-S.1
Liu, H.-M.2
Chen, C.-L.3
-
21
-
-
43049100343
-
Plasma surface treatment of polyimide for adhesive Cu/80Ni20Cr/PI flexible copper clad laminate
-
J.S. Eom, and S.H. Kim Plasma surface treatment of polyimide for adhesive Cu/80Ni20Cr/PI flexible copper clad laminate Thin Solid Films 516 2008 4530 4534
-
(2008)
Thin Solid Films
, vol.516
, pp. 4530-4534
-
-
Eom, J.S.1
Kim, S.H.2
-
22
-
-
79952317078
-
-
content/Test%20Metal%20Tape.pdf
-
http://www.eurometallizers.org/files-content/Test%20Metal%20Tape.pdf.
-
-
-
-
24
-
-
84896690318
-
Heterogenization of a new Ru(II) homogeneous asymmetric hydrogenation catalyst containing BINAP and the N-tridentate bpea ligand, through covalent attachment on amorphous AlPO4 support
-
F.M. Bautista, V. Caballero, J.M. Campelo, D. Luna, J.M. Marinas, A.A. Romero, I. Romero, I. Serrano, and A. Llobet Heterogenization of a new Ru(II) homogeneous asymmetric hydrogenation catalyst containing BINAP and the N-tridentate bpea ligand, through covalent attachment on amorphous AlPO4 support Topics in Catalysis 40 2006 193 205
-
(2006)
Topics in Catalysis
, vol.40
, pp. 193-205
-
-
Bautista, F.M.1
Caballero, V.2
Campelo, J.M.3
Luna, D.4
Marinas, J.M.5
Romero, A.A.6
Romero, I.7
Serrano, I.8
Llobet, A.9
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