The effect of (Ag, Ni, Zn)-addition on the thermoelectric properties of copper aluminate

Materials

Volumn 3, Issue 1, 2010, Pages 318-328

  Yanagiya, Shun ichi ^a,b   Van Nong, Ngo ^b   Xu, Jianxiao ^b   Pryds, Nini ^b  

^a HAKODATE NATIONAL COLLEGE OF TECHNOLOGY   (Japan)

^b TECHNICAL UNIVERSITY OF DENMARK   (Denmark)

Author keywords

Copper aluminate; Element addition; Oxide material; Thermoelectric properties

Indexed keywords

ELECTRICAL CONDUCTIVITY; ELEMENT ADDITION; HIGH TEMPERATURE THERMOELECTRIC PROPERTIES; OXIDE MATERIALS; PARTIAL SUBSTITUTION; POLY-CRYSTALLINE BULK; POWER FACTORS; THERMOELECTRIC PROPERTIES;

COPPER; ELECTRIC CONDUCTIVITY; ELECTRIC POWER FACTOR; HIGH TEMPERATURE EFFECTS; NICKEL; SPARK PLASMA SINTERING; THERMOELECTRIC EQUIPMENT; THERMOELECTRICITY; ZINC;

SILVER;

EID: 79952280547     PISSN: None     EISSN: 19961944     Source Type: Journal    
DOI: 10.3390/ma3010318     Document Type: Article

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