SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 38, Issue 11, 2009, Pages 2405-2414

Wetting behavior and mechanical properties of sn-zn and sn-Pb solder alloys

(4) Garcia, Leonardo R a Osório, Wislei R a Peixoto, Leandro C a Garcia, Amauri a

a UNIVERSITY OF CAMPINAS (Brazil)

Author keywords

Cooling rate; Hot dipping; Mechanical properties; Sn Zn solder alloys; Solidification; Wettability

Indexed keywords

COOLING RATE; EXPERIMENTAL STUDIES; HOT-DIPPING; MECHANICAL STRENGTH; PB SOLDERS; SN-9WT.%ZN; SN-PB ALLOYS; SN-ZN SOLDER ALLOYS; SNPB SOLDER; SOLDER MATERIAL; ULTIMATE TENSILE STRENGTH; WETTABILITY; WETTING BEHAVIOR;

ALLOYS; CERIUM ALLOYS; CONTACT ANGLE; COOLING; CRYSTALLIZATION; EUTECTICS; LEAD; MECHANICAL PROPERTIES; SOLIDIFICATION; TENSILE STRENGTH; TIN ALLOYS; ZINC; ZINC ALLOYS;

TIN;

EID: 70349859624 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-009-0888-y Document Type: Article

Times cited : (58)

References (39)

1
- 0034240575
- Effects of process parameters on the soldering behavior of the eutectic Sn-Zn solder on Cu substrate
- DOI 10.1023/A:1008960316695
- SP Yu HJ Lin MH Hon 2000 J. Mater. Sci. Mater. Electron. 11 461 10.1023/A:1008960316695 1:CAS:528:DC%2BD3MXktVKgtQ%3D%3D (Pubitemid 32076399)
- (2000) Journal of Materials Science: Materials in Electronics , vol.11 , Issue.6 , pp. 461-471
- Yu, S.-P.¹ Lin, H.-J.² Hon, M.-H.³ Wang, M.-C.⁴

2
- 33846839559
- Effect of Cu additions on the structural and mechanical properties of Sn-Zn alloy
- DOI 10.1016/j.msea.2006.10.015, PII S0921509306021320
- FA El-Salam RH Nada AMA El-Khalek 2007 Mater. Sci. Eng. A 448 171 10.1016/j.msea.2006.10.015 (Pubitemid 46202156)
- (2007) Materials Science and Engineering A , vol.448 , Issue.1-2 , pp. 171-176
- Abd El-Salam, F.¹ Nada, R.H.² Abd El-Khalek, A.M.³

3
- 33845688716
- Sn-Zn low temperature solder
- DOI 10.1007/s10854-006-9018-2
- K Suganuma KS Kim 2007 J. Mater. Sci. Mater. Electron. 18 121 10.1007/s10854-006-9018-2 1:CAS:528:DC%2BD28XhtlWntL3L (Pubitemid 44963680)
- (2007) Journal of Materials Science: Materials in Electronics , vol.18 , Issue.1-3 , pp. 121-127
- Suganuma, K.¹ Kim, K.-S.²

4
- 33746820648
- Comparative study of wetting behavior and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders
- DOI 10.1016/j.mejo.2005.12.010, PII S0026269205004118
- RA Islam YC Chan W Jillek S Islam 2006 Microelectron. J. 37 705 10.1016/j.mejo.2005.12.010 1:CAS:528:DC%2BD28XltleqsbY%3D (Pubitemid 44177482)
- (2006) Microelectronics Journal , vol.37 , Issue.8 , pp. 705-713
- Islam, R.A.¹ Chan, Y.C.² Jillek, W.³ Islam, S.⁴

5
- 33749342973
- 10.1007/s11664-006-0227-5 2006JEMat.35.1734C 1:CAS:528: DC%2BD28Xpslais7k%3D
- X Chen M Li XX Ren AM Hu DL Mao 2006 J. Electron. Mater. 35 1734 10.1007/s11664-006-0227-5 2006JEMat..35.1734C 1:CAS:528:DC%2BD28Xpslais7k%3D
- (2006) J. Electron. Mater. , vol.35 , pp. 1734
- Chen, X.¹ Li, M.² Ren, X.X.³ Hu, A.M.⁴ Mao, D.L.⁵

6
- 49749113756
- 10.1016/j.jallcom.2007.09.103 1:CAS:528:DC%2BD1cXhtVagsr%2FM
- C Wei YC Liu YJ Han JB Wan K Yang 2008 J. Alloys Compd. 464 301 10.1016/j.jallcom.2007.09.103 1:CAS:528:DC%2BD1cXhtVagsr%2FM
- (2008) J. Alloys Compd. , vol.464 , pp. 301
- Wei, C.¹ Liu, Y.C.² Han, Y.J.³ Wan, J.B.⁴ Yang, K.⁵

7
- 0038350778
- K.L. Lin, K.I. Chen, H.M. Hsu, and C.L. Shi, Electronic Components and Technology Conference (2003), p. 658.
- (2003) Electronic Components and Technology Conference , pp. 658
- Lin, K.L.¹ Chen, K.I.² Hsu, H.M.³ Shi, C.L.⁴

8
- 51849149868
- 10.1007/s11664-008-0502-8 2008JEMat.37.1640W 1:CAS:528:DC%2BD1cXhtFWitbjF
- H Wang H Zhao DP Sekulic Y Qian 2008 J. Electron. Mater. 37 1640 10.1007/s11664-008-0502-8 2008JEMat..37.1640W 1:CAS:528:DC%2BD1cXhtFWitbjF
- (2008) J. Electron. Mater. , vol.37 , pp. 1640
- Wang, H.¹ Zhao, H.² Sekulic, D.P.³ Qian, Y.⁴

9
- 51849157741
- 10.1007/s11664-008-0509-1 2008JEMat.37.1618S 1:CAS:528:DC%2BD1cXhtFWitbvE
- J Sylvestre A Blander 2008 J. Electron. Mater. 37 1618 10.1007/s11664-008-0509-1 2008JEMat..37.1618S 1:CAS:528:DC%2BD1cXhtFWitbvE
- (2008) J. Electron. Mater. , vol.37 , pp. 1618
- Sylvestre, J.¹ Blander, A.²

10
- 51649138888
- 10.1007/BF02653357 1994JEMat.23.687M 1:CAS:528:DyaK2cXltFGjsb8%3D
- M McCormack S Jin HS Chen DA Machusak 1994 J. Electron. Mater. 23 687 10.1007/BF02653357 1994JEMat..23..687M 1:CAS:528:DyaK2cXltFGjsb8%3D
- (1994) J. Electron. Mater. , vol.23 , pp. 687
- McCormack, M.¹ Jin, S.² Chen, H.S.³ MacHusak, D.A.⁴

11
- 0037463944
- 10.1016/S0925-8388(02)01166-0 1:CAS:528:DC%2BD3sXitlert7g%3D
- KS Kim SH Huh K Suganuma 2003 J. Alloys Compd. 352 226 10.1016/S0925-8388(02)01166-0 1:CAS:528:DC%2BD3sXitlert7g%3D
- (2003) J. Alloys Compd. , vol.352 , pp. 226
- Kim, K.S.¹ Huh, S.H.² Suganuma, K.³

12
- 36449008212
- 10.1063/1.109734 1993ApPhL.63.15M 1:CAS:528:DyaK3sXlsVCgt7s%3D
- M McCormack S Jin GW Kammlott HS Chen 1993 Appl. Phys. Lett. 63 15 10.1063/1.109734 1993ApPhL..63...15M 1:CAS:528:DyaK3sXlsVCgt7s%3D
- (1993) Appl. Phys. Lett. , vol.63 , pp. 15
- McCormack, M.¹ Jin, S.² Kammlott, G.W.³ Chen, H.S.⁴

13
- 51649133658
- 10.1007/BF02653344 1994JEMat.23.595M 1:CAS:528:DyaK2cXntVGqt7k%3D
- CM Miller IE Anderson JF Smith 1994 J. Electron. Mater. 23 595 10.1007/BF02653344 1994JEMat..23..595M 1:CAS:528:DyaK2cXntVGqt7k%3D
- (1994) J. Electron. Mater. , vol.23 , pp. 595
- Miller, C.M.¹ Anderson, I.E.² Smith, J.F.³

14
- 50249177135
- 10.1002/maco.200804098 1:CAS:528:DC%2BD1cXhtVOhsL7J
- G Montesperelli M Rapone F Nanni P Travaglia P Riani R Marazza G Gusmano 2008 Mater. Corr. 59 662 10.1002/maco.200804098 1:CAS:528:DC%2BD1cXhtVOhsL7J
- (2008) Mater. Corr. , vol.59 , pp. 662
- Montesperelli, G.¹ Rapone, M.² Nanni, F.³ Travaglia, P.⁴ Riani, P.⁵ Marazza, R.⁶ Gusmano, G.⁷

15
- 51249170022
- 10.1007/BF02653349 1994JEMat.23.635M 1:CAS:528:DyaK2cXltFGjsb4%3D
- M McCormack S Jin 1994 J. Electron. Mater. 23 635 10.1007/BF02653349 1994JEMat..23..635M 1:CAS:528:DyaK2cXltFGjsb4%3D
- (1994) J. Electron. Mater. , vol.23 , pp. 635
- McCormack, M.¹ Jin, S.²

16
- 4043114060
- 10.1007/s11664-004-0222-7 2004JEMat.33.923S 1:CAS:528: DC%2BD2cXmtlylsrs%3D
- I Shohji C Gagg WJ Plumbridge 2004 J. Electron. Mater. 33 923 10.1007/s11664-004-0222-7 2004JEMat..33..923S 1:CAS:528:DC%2BD2cXmtlylsrs%3D
- (2004) J. Electron. Mater. , vol.33 , pp. 923
- Shohji, I.¹ Gagg, C.² Plumbridge, W.J.³

17
- 33846191172
- Effect of substrate metallization on interfacial reactions and reliability of Sn-Zn-Bi solder joints
- DOI 10.1016/j.mee.2006.10.087, PII S0167931706005910, VLSI Design and Test
- A Sharif YC Chan 2007 Microelectron. Eng. 84 328 10.1016/j.mee.2006.10. 087 1:CAS:528:DC%2BD2sXntVKjtA%3D%3D (Pubitemid 46097155)
- (2007) Microelectronic Engineering , vol.84 , Issue.2 , pp. 328-335
- Sharif, A.¹ Chan, Y.C.²

18
- 70349859704
- San Diego, California February 17-19
- J. Madeni, S. Liu, and T. Siewert, 2nd International Brazing and Soldering Conference (ISBC) (San Diego, California, 2003), February 17-19.
- (2003) 2nd International Brazing and Soldering Conference (ISBC)
- Madeni, J.¹ Liu, S.² Siewert, T.³

19
- 0014888672
- JT Berry 1970 AFS Trans. 78 421
- (1970) AFS Trans. , vol.78 , pp. 421
- Berry, J.T.¹

20
- 0034441621
- 1:CAS:528:DC%2BD3cXitVOrsrY%3D
- P Donelan 2000 Mater. Sci. Technol. 16 261 1:CAS:528:DC%2BD3cXitVOrsrY%3D
- (2000) Mater. Sci. Technol. , vol.16 , pp. 261
- Donelan, P.¹

21
- 0034489871
- 10.1007/s11661-000-0096-0
- JM Quaresma CA Santos A Garcia 2000 Metall. Mater. Trans. A 31 3167 10.1007/s11661-000-0096-0
- (2000) Metall. Mater. Trans. A , vol.31 , pp. 3167
- Quaresma, J.M.¹ Santos, C.A.² Garcia, A.³

22
- 0037186801
- Modeling dendritic structure and mechanical properties of Zn-Al alloys as a function of solidification conditions
- DOI 10.1016/S0921-5093(01)01455-1, PII S0921509301014551
- WR Osório A Garcia 2002 Mater. Sci. Eng. A 325 103 10.1016/S0921-5093(01)01455-1 (Pubitemid 34209629)
- (2002) Materials Science and Engineering A , vol.325 , Issue.1-2 , pp. 103-111
- Osorio, W.R.¹ Garcia, A.²

23
- 0242523614
- 10.1016/S0924-0136(03)00355-8
- WR Osório CA Santos JMV Quaresma A Garcia 2003 J. Mater. Process. Technol. 143 703 10.1016/S0924-0136(03)00355-8
- (2003) J. Mater. Process. Technol. , vol.143 , pp. 703
- Osório, W.R.¹ Santos, C.A.² Quaresma, J.M.V.³ Garcia, A.⁴

24
- 33747426296
- Effect of dendritic arm spacing on mechanical properties and corrosion resistance of Al 9 wt pct Si and Zn 27 wt pct Al alloys
- DOI 10.1007/BF02586225
- WR Osório PR Goulart GA Santos C Moura Neto A Garcia 2006 Metall. Mater. Trans. A 37 2525 10.1007/BF02586225 (Pubitemid 44251559)
- (2006) Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science , vol.37 , Issue.8 , pp. 2525-2538
- Osorio, W.R.¹ Goulart, P.R.² Santos, G.A.³ Neto, C.M.⁴ Garcia, A.⁵

25
- 33645535324
- 10.1016/j.msea.2006.01.058
- WR Osório JE Spinelli N Cheung A Garcia 2006 Mater. Sci. Eng. A 420 179 10.1016/j.msea.2006.01.058
- (2006) Mater. Sci. Eng. A , vol.420 , pp. 179
- Osório, W.R.¹ Spinelli, J.E.² Cheung, N.³ Garcia, A.⁴

26
- 0036649384
- 10.1007/s11661-002-0042-4
- CA Siqueira N Cheung A Garcia 2002 Metall. Mater. Trans. A 33 2107 10.1007/s11661-002-0042-4
- (2002) Metall. Mater. Trans. A , vol.33 , pp. 2107
- Siqueira, C.A.¹ Cheung, N.² Garcia, A.³

27
- 56049094077
- 10.1016/j.jpowsour.2008.08.040
- WR Osório CSC Aoki A Garcia 2008 J. Power Sources 185 1471 10.1016/j.jpowsour.2008.08.040
- (2008) J. Power Sources , vol.185 , pp. 1471
- Osório, W.R.¹ Aoki, C.S.C.² Garcia, A.³

28
- 0032188151
- 10.1557/JMR.1998.0391 1998JMatR.13.2859S 1:CAS:528:DyaK1cXms1aqs7w%3D
- K Suganuma K Niihara T Shoutoku Y Nakamura 1998 J. Mater. Res. 13 2859 10.1557/JMR.1998.0391 1998JMatR..13.2859S 1:CAS:528:DyaK1cXms1aqs7w%3D
- (1998) J. Mater. Res. , vol.13 , pp. 2859
- Suganuma, K.¹ Niihara, K.² Shoutoku, T.³ Nakamura, Y.⁴

29
- 0037326871
- 10.1007/s11664-003-0238-4 2003JEMat.32.63W 1:CAS:528:DC%2BD3sXhtFalurc%3D
- CML Wu CMT Law DQ Yu L Wang 2003 J. Electron. Mater. 32 63 10.1007/s11664-003-0238-4 2003JEMat..32...63W 1:CAS:528:DC%2BD3sXhtFalurc%3D
- (2003) J. Electron. Mater. , vol.32 , pp. 63
- Wu, C.M.L.¹ Law, C.M.T.² Yu, D.Q.³ Wang, L.⁴

30
- 1642324965
- 10.1016/j.mser.2004.01.001
- CML Wu DQ Yu CMT Law L Wang 2004 Mater. Sci. Eng. R 44 1 10.1016/j.mser.2004.01.001
- (2004) Mater. Sci. Eng. R , vol.44 , pp. 1
- Wu, C.M.L.¹ Yu, D.Q.² Law, C.M.T.³ Wang, L.⁴

31
- 0006578816
- 10.1088/0370-1328/71/1/313
- TC Toye ER Jones 1957 Proc. Phys. Soc. 71 88 10.1088/0370-1328/71/1/313
- (1957) Proc. Phys. Soc. , vol.71 , pp. 88
- Toye, T.C.¹ Jones, E.R.²

32
- 0036738902
- 10.1007/s11664-002-0187-3 2002JEMat.31.940C 1:CAS:528: DC%2BD38XntFOktb4%3D
- SC Cheng KL Lin 2002 J. Electron. Mater. 31 940 10.1007/s11664-002-0187-3 2002JEMat..31..940C 1:CAS:528:DC%2BD38XntFOktb4%3D
- (2002) J. Electron. Mater. , vol.31 , pp. 940
- Cheng, S.C.¹ Lin, K.L.²

33
- 49049115910
- 10.1007/s11661-008-9542-1
- DM Rosa JE Spinelli IL Ferreira A Garcia 2008 Metall. Mater. Trans. A 39 2161 10.1007/s11661-008-9542-1
- (2008) Metall. Mater. Trans. A , vol.39 , pp. 2161
- Rosa, D.M.¹ Spinelli, J.E.² Ferreira, I.L.³ Garcia, A.⁴

34
- 33845230838
- On the advantages of using a hypoeutectic Sn-Zn as lead-free solder material
- DOI 10.1016/j.matlet.2006.05.029, PII S0167577X06006318
- X Wei H Huang L Zhou M Zhang X Liu 2007 Mater. Lett. 61 655 10.1016/j.matlet.2006.05.029 1:CAS:528:DC%2BD28Xht12ksr3J (Pubitemid 44855945)
- (2007) Materials Letters , vol.61 , Issue.3 , pp. 655-658
- Wei, X.¹ Huang, H.² Zhou, L.³ Zhang, M.⁴ Liu, X.⁵

35
- 0004294620
- McGraw Hill New York
- M.C. Flemings, Solidification Processing (New York: McGraw Hill, 1974).
- (1974) Solidification Processing
- Flemings, M.C.¹

36
- 64049095223
- 10.1016/j.matlet.2009.03.011 1:CAS:528:DC%2BD1MXksVals7c%3D
- LR Garcia LC Peixoto WR Osório A Garcia 2009 Mater. Lett. 63 1314 10.1016/j.matlet.2009.03.011 1:CAS:528:DC%2BD1MXksVals7c%3D
- (2009) Mater. Lett. , vol.63 , pp. 1314
- Garcia, L.R.¹ Peixoto, L.C.² Osório, W.R.³ Garcia, A.⁴

37
- 6344278527
- 10.1016/j.microrel.2004.04.016 1:CAS:528:DC%2BD2cXosFSmur4%3D
- S Wiese K Wolter 2004 Microelectron. Reliab. 44 1923 10.1016/j.microrel. 2004.04.016 1:CAS:528:DC%2BD2cXosFSmur4%3D
- (2004) Microelectron. Reliab. , vol.44 , pp. 1923
- Wiese, S.¹ Wolter, K.²

38
- 70349876346
- YS Kim KS Kim CW Hwang K Suganuma 2003 J. Alloys Compd. 352 233
- (2003) J. Alloys Compd. , vol.352 , pp. 233
- Kim, Y.S.¹ Kim, K.S.² Hwang, C.W.³ Suganuma, K.⁴

39
- 40749132962
- 10.1016/j.jallcom.2006.12.037 1:CAS:528:DC%2BD1cXjs12msbk%3D
- JE Lee KS Kim M Inoue J Jiang K Suganuma 2008 J. Alloys Compd. 454 310 10.1016/j.jallcom.2006.12.037 1:CAS:528:DC%2BD1cXjs12msbk%3D
- (2008) J. Alloys Compd. , vol.454 , pp. 310
- Lee, J.E.¹ Kim, K.S.² Inoue, M.³ Jiang, J.⁴ Suganuma, K.⁵

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.