SCOPUS 정보 검색 플랫폼

Journal of Electronic Materials

Volumn 40, Issue 3, 2011, Pages 315-323

Mechanical properties and electrochemical corrosion behavior of Al/Sn-9Zn-xAg/Cu joints

(4) Huang, M L a Huang, Y Z a Ma, H T a Zhao, J a

a DALIAN UNIVERSITY OF TECHNOLOGY (China)

Author keywords

Al Cu joint; corrosion potential; electrochemical corrosion; mechanical properties; Sn 9Zn xAg

Indexed keywords

AL SUBSTRATE; AL-CU JOINT; COPPER SUBSTRATES; CORROSION POTENTIAL; CORROSION POTENTIALS; CU SUBSTRATE; ELECTROCHEMICAL CORROSION BEHAVIOR; MATRIX; NACL SOLUTION; SN-9ZN SOLDER; SN-9ZN-XAG; SOLDER JOINTS; SOLDER MATRIX; WETTING BEHAVIOR;

ALUMINUM; CORROSION RESISTANCE; CORROSIVE EFFECTS; ELECTROCHEMICAL CORROSION; ELECTROCHEMICAL PROPERTIES; ELECTROCHEMISTRY; MECHANICAL PROPERTIES; SHEAR STRENGTH; SILVER; SODIUM CHLORIDE; SOLDERING; SOLDERING ALLOYS; SUBSTRATES; ZINC;

TIN;

EID: 79952185335 PISSN: 03615235 EISSN: None Source Type: Journal
DOI: 10.1007/s11664-010-1459-y Document Type: Article

Times cited : (38)

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