Effect of pulse-plated nickel barriers on tin whisker growth for pure tin solder joints

Journal of Electronic Materials

Volumn 37, Issue 6, 2008, Pages 894-900

  Chen, Min Na ^a   Ding, Shi Jin ^a   Sun, Qing Qing ^a   Zhang, David Wei ^a   Wang, Li Kang ^a  

^a FUDAN UNIVERSITY   (China)

Author keywords

Pulse plated Ni barriers; Scanning electron microscopy; Sn whisker growth; X ray diffraction

Indexed keywords

HILLOCKS; PULSE-PLATED BARRIERS; WHISKER GROWTH;

ATMOSPHERIC HUMIDITY; CRYSTAL GROWTH; INTERMETALLICS; LAMINATED COMPOSITES; SCANNING ELECTRON MICROSCOPY; SOLDERED JOINTS; TEXTURES; X RAY DIFFRACTION;

CRYSTAL WHISKERS;

EID: 42449158426     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-008-0412-9     Document Type: Article

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