Modified diffusion bonding of chemical mechanical polishing Cu at 150 °C at ambient pressure

Applied Physics Express

Volumn 2, Issue 5, 2009, Pages

  Shigetou, Akitsu ^a   Suga, Tadatomo ^b  

^a NATIONAL INSTITUTE FOR MATERIALS SCIENCE   (Japan)

^b UNIVERSITY OF TOKYO   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

AMBIENT AIR; AMBIENT PRESSURES; BONDING STRENGTH; CU FILMS; CU THIN FILM; FAST ATOM BEAMS; IN-VACUUM; INTERFACIAL LAYER; LOW-TEMPERATURE BONDING PROCESS; VACUUM CHAMBERS; WATER MOLECULE;

ATMOSPHERIC PRESSURE; BONDING; CHEMICAL MECHANICAL POLISHING; CHEMICAL POLISHING; COPPER OXIDES; DIFFUSION BONDING; THIN FILMS; VACUUM;

COPPER;

EID: 66949147892     PISSN: 18820778     EISSN: 18820786     Source Type: Journal    
DOI: 10.1143/APEX.2.056501     Document Type: Article

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