Evaluation of different die attach film and epoxy pastes for stacked die QFN package

Proceedings of the Electronic Packaging Technology Conference, EPTC

Volumn , Issue , 2007, Pages 869-873

  Ahmad, Ibrahim ^a   Bachok, Nur Nadia ^a   Chiang, Ng Cheong ^a   Talib, Meor Zainal Meor ^a   Rosle, Mohamad Firdaus ^a   Latip, Farah Liyana Ab ^a   Aziz, Zurlinda Asma ^a  

^a UNIVERSITI KEBANGSAAN MALAYSIA   (Malaysia)

Author keywords

[No Author keywords available]

Indexed keywords

DIES; ELECTRONICS PACKAGING; FINITE ELEMENT METHOD; NONMETALS; PAINTING; SEMICONDUCTING SILICON COMPOUNDS; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON; TECHNOLOGY;

AND MODELING; COMPONENT SIZE; DIE ATTACH; DIE-ATTACH MATERIALS; EPOXY PASTES; FINITE ELEMENT MODEL; INDUCED STRESSES; PACKAGE DESIGNS; PACKAGING TECHNOLOGIES; QFN PACKAGING; QUAD FLAT NO-LEAD PACKAGING; RELIABILITY PERFORMANCE; SEMICONDUCTOR INDUSTRIES; SHEAR TESTING; SILICON DIES;

ELECTRONIC EQUIPMENT MANUFACTURE;

EID: 50049103147     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/EPTC.2007.4469691     Document Type: Conference Paper

References (5)

1. rd Electronic Components and Technology Conference, Finland, 2003, pp. 1197-1202.
2. th International Conference on Electronics Materials and Packaging, Singapore, 2003, pp. 27-32.
3. Ng, C. C., and Govindasamy, G., "Effect of Die Stacking Structures on QFN Package Robustness," SEMICON Singapore SEMI Technology Symposium, Singapore, 2005.
4. th Electronic Components and Technology Conference, USA, 2000, pp. 1311-1319.
5. Ng, C. C., and Embong, S. S., "Investigation of Sheared Die Using Both Computational Fluid Dynamics and Solid Modeling Techniques," SEMICON Singapore SEMI Technology Symposium, Singapore, 2004, pp. 115-120.