A micropatterned metal embedding process for the formation of metal lines in flexible electronics

Journal of Micromechanics and Microengineering

Volumn 18, Issue 3, 2008, Pages

  Jung, Phill Gu ^a   Jung, Im Deok ^a   Lee, Sang Min ^a   Ko, Jong Soo ^a  

^a Pusan National University   (South Korea)

Author keywords

[No Author keywords available]

Indexed keywords

ALUMINUM; BENDING TESTS; SILICON; SUBSTRATES;

METAL PATTERNING; MICROPATTERNED METAL EMBEDDING (MME);

EMBEDDED SYSTEMS;

EID: 42549111172     PISSN: 09601317     EISSN: 13616439     Source Type: Journal    
DOI: 10.1088/0960-1317/18/3/035017     Document Type: Article

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