-
2
-
-
33947269110
-
Cooling a Microprocessor Chip
-
R. Mahajan, C.-P. Chiu, and G. Chrysler, "Cooling a Microprocessor Chip," Proceedings of the IEEE, vol. 94, no. 8 (2006), pp. 1476-1486.
-
(2006)
Proceedings of the IEEE
, vol.94
, Issue.8
, pp. 1476-1486
-
-
Mahajan, R.1
Chiu, C.-P.2
Chrysler, G.3
-
3
-
-
33947286619
-
Thermal interface materials: Historical perspective, status, and future directions
-
R. Prasher, "Thermal interface materials: Historical perspective, status, and future directions," Proceedings of the IEEE, vol. 94, no. 8 (2006), pp. 1571-1586.
-
(2006)
Proceedings of the IEEE
, vol.94
, Issue.8
, pp. 1571-1586
-
-
Prasher, R.1
-
4
-
-
0026835355
-
A survey of reliability-prediction procedures for microelectronic devices
-
J. Bowles, "A survey of reliability-prediction procedures for microelectronic devices," Reliability, IEEE Transactions on, vol. 41, no. 1 (1992), pp. 2-12.
-
(1992)
Reliability, IEEE Transactions on
, vol.41
, Issue.1
, pp. 2-12
-
-
Bowles, J.1
-
5
-
-
0029271008
-
Characterization of functional relationship between temperature and microelectronic reliability
-
P. Lall, M. Pecht, and E.B. Hakim, "Characterization of functional relationship between temperature and microelectronic reliability," Microelectronics and Reliability, vol. 35, no. 3 (1995), pp. 377-402.
-
(1995)
Microelectronics and Reliability
, vol.35
, Issue.3
, pp. 377-402
-
-
Lall, P.1
Pecht, M.2
Hakim, E.B.3
-
6
-
-
77953636772
-
Energy dissipation and transport in nanoscale devices
-
E. Pop, "Energy dissipation and transport in nanoscale devices," Nano Research, vol. 3, no. 3 (2010), pp. 147-169.
-
(2010)
Nano Research
, vol.3
, Issue.3
, pp. 147-169
-
-
Pop, E.1
-
9
-
-
32844472118
-
Thermal interface material technology advancements and challenges - An overview
-
A. Dani, J. Matayabas Jr., and P. Koning, "Thermal interface material technology advancements and challenges - An overview," Proceedings of the ASMEIPacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005, 2005, pp. 511-516.
-
(2005)
Proceedings of the ASMEIPacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems: Advances in Electronic Packaging 2005
, pp. 511-516
-
-
Dani, A.1
Matayabas Jr., J.2
Koning, P.3
-
10
-
-
22044456185
-
Aligned Carbon Nanotube Composite Films for Thermal Management
-
H. Huang, C. Liu, Y. Wu, and S. Fan, "Aligned Carbon Nanotube Composite Films for Thermal Management," Advanced Materials, vol. 17, no. 13 (2005), pp. 1652-1656.
-
(2005)
Advanced Materials
, vol.17
, Issue.13
, pp. 1652-1656
-
-
Huang, H.1
Liu, C.2
Wu, Y.3
Fan, S.4
-
11
-
-
70349139312
-
Carbon nanotube array thermal interfaces enhanced with paraffm wax
-
B. Cola, S. Hodson, X. Xu, and T. Fisher, "Carbon nanotube array thermal interfaces enhanced with paraffm wax," 2008 Proceedings of the ASME Summer Heat Transfer Conference, HT 2008, 2009, pp. 765-770.
-
(2009)
2008 Proceedings of the ASME Summer Heat Transfer Conference, HT 2008
, pp. 765-770
-
-
Cola, B.1
Hodson, S.2
Xu, X.3
Fisher, T.4
-
12
-
-
0242468497
-
Enhancement of thermal and electrical properties of carbon nanotube polymer composites by magnetic field processing
-
E.S. Choi, J.S. Brooks, D.L. Eaton, M.S. AI-Haik, M.Y. Hussaini, H. Garmestani, D. Li, and K. Dahmen, "Enhancement of thermal and electrical properties of carbon nanotube polymer composites by magnetic field processing," Journal of Applied Physics, vol. 94, no. 9 (2003), pp. 6034-6039.
-
(2003)
Journal of Applied Physics
, vol.94
, Issue.9
, pp. 6034-6039
-
-
Choi, E.S.1
Brooks, J.S.2
Eaton, D.L.3
Ai-Haik, M.S.4
Hussaini, M.Y.5
Garmestani, H.6
Li, D.7
Dahmen, K.8
-
13
-
-
73849145645
-
Silver nanowire array-polymer composite as thermal interface material
-
J. Xu, A. Munari, E. Dalton, A. Mathewson, and K. Razeeb, "Silver nanowire array-polymer composite as thermal interface material," Journal of Applied Physics, vol. 106, no. 12 (2009), p. 124310.
-
(2009)
Journal of Applied Physics
, vol.106
, Issue.12
, pp. 124310
-
-
Xu, J.1
Munari, A.2
Dalton, E.3
Mathewson, A.4
Razeeb, K.5
-
14
-
-
43049108459
-
Thermal diffusivity of nonfractal and fractal nickel nanowires
-
K.M. Razeeb and S. Roy, "Thermal diffusivity of nonfractal and fractal nickel nanowires," Journal of Applied Physics, vol. 103, no. 8 (2008), p. 084302.
-
(2008)
Journal of Applied Physics
, vol.103
, Issue.8
, pp. 084302
-
-
Razeeb, K.M.1
Roy, S.2
-
15
-
-
0026854448
-
Thermal and rheological properties of miscible polyethersulfone/polyimide blends
-
K. Liang, J. Grebowicz, E. Valles, F.E. Karasz, and W.J. MacKnight, "Thermal and rheological properties of miscible polyethersulfone/polyimide blends," Journal of Polymer Science Part B: Polymer Physics, vol. 30, no. 5 (1992), pp. 465-476.
-
(1992)
Journal of Polymer Science Part B: Polymer Physics
, vol.30
, Issue.5
, pp. 465-476
-
-
Liang, K.1
Grebowicz, J.2
Valles, E.3
Karasz, F.E.4
MacKnight, W.J.5
-
16
-
-
11744336762
-
Flash method of determining thermal diffusivity, heat capacity, and thermal conductivity
-
W. Parker, R. Jenkins, C. Butler, and G. Abbott, "Flash method of determining thermal diffusivity, heat capacity, and thermal conductivity," Journal of Applied Physics, vol. 32, no. 99 (1961), pp. 1679-1684.
-
(1961)
Journal of Applied Physics
, vol.32
, Issue.99
, pp. 1679-1684
-
-
Parker, W.1
Jenkins, R.2
Butler, C.3
Abbott, G.4
-
17
-
-
2142681463
-
Pulse Method of Measuring Thermal Diffusivity at High Temperatures
-
R.D. Cowan, "Pulse Method of Measuring Thermal Diffusivity at High Temperatures," Journal of Applied Physics, vol. 34, no. 4 (1963), pp. 926-927.
-
(1963)
Journal of Applied Physics
, vol.34
, Issue.4
, pp. 926-927
-
-
Cowan, R.D.1
-
19
-
-
0042746609
-
Properties of Wrought Copper and Copper Alloys
-
Materials Park, OH, USA: ASM International
-
J.R. Davis, Ed., "Properties of Wrought Copper and Copper Alloys," ASM Speciality Handbook: Copper and Copper Alloys, Materials Park, OH, USA: ASM International, 2001, pp. 453-528.
-
(2001)
ASM Speciality Handbook: Copper and Copper Alloys
, pp. 453-528
-
-
Davis, J.R.1
-
20
-
-
0036133317
-
Characterization of solder interfaces using laser flash metrology
-
C. Chiu, J.G. Maveety, and Q.A. Tran, "Characterization of solder interfaces using laser flash metrology," Microelectronics Reliability, vol. 42, no. 1 (2002), pp. 93-100.
-
(2002)
Microelectronics Reliability
, vol.42
, Issue.1
, pp. 93-100
-
-
Chiu, C.1
Maveety, J.G.2
Tran, Q.A.3
-
21
-
-
27844542834
-
Measurement of solder/copper interfacial thermal resistance by the flash technique
-
J. Bai, Z. Zhang, G. Lu, and D. Hasselman, "Measurement of solder/copper interfacial thermal resistance by the flash technique," International Journal of Thermophysics, vol. 26, no. 5 (2005), pp. 1607-1615.
-
(2005)
International Journal of Thermophysics
, vol.26
, Issue.5
, pp. 1607-1615
-
-
Bai, J.1
Zhang, Z.2
Lu, G.3
Hasselman, D.4
-
22
-
-
0003855525
-
-
Materials Park, OH, USA: ASM International
-
J.R. Davis, Ed., Metals Handbook, Materials Park, OH, USA: ASM International, 1998.
-
(1998)
Metals Handbook
-
-
Davis, J.R.1
-
23
-
-
70249103841
-
Innovative Architecture of Thermal Solution for Microprocessors
-
C. Hu, D.D. Lu, and G.J. Vandentop, "Innovative Architecture of Thermal Solution for Microprocessors," Japanese Journal of Applied Physics, vol. 48, 2009, p. 05.
-
(2009)
Japanese Journal of Applied Physics
, vol.48
, pp. 05
-
-
Hu, C.1
Lu, D.D.2
Vandentop, G.J.3
-
24
-
-
0003418226
-
-
Boca Raton, FL, USA, CRC Press
-
P. Lall, M. Pecht, and E.B. Hakim, Influence of temperature on microelectronics and system reliability, Boca Raton, FL, USA, CRC Press, 1997.
-
(1997)
Influence of Temperature on Microelectronics and System Reliability
-
-
Lall, P.1
Pecht, M.2
Hakim, E.B.3
-
25
-
-
2342598921
-
Thermal characterization of eutectic alloy thermal interface materials with void-like inclusions
-
X. Hu, L. Jiang, and K. Goodson, "Thermal characterization of eutectic alloy thermal interface materials with void-like inclusions," Semiconductor Thermal Measurement and Management Symposium, 2004. Twentieth Annual IEEE, 2004, pp. 98-103.
-
(2004)
Semiconductor Thermal Measurement and Management Symposium, 2004. Twentieth Annual IEEE
, pp. 98-103
-
-
Hu, X.1
Jiang, L.2
Goodson, K.3
-
26
-
-
33645153130
-
The effect of die attach voiding on the thermal resistance of chip level packages
-
A.S. Fleischer, L. Chang, and B.C. Johnson, "The effect of die attach voiding on the thermal resistance of chip level packages," Microelectronics and Reliability, vol. 46, no. 5-6 (2006), pp. 794-804.
-
(2006)
Microelectronics and Reliability
, vol.46
, Issue.5-6
, pp. 794-804
-
-
Fleischer, A.S.1
Chang, L.2
Johnson, B.C.3
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