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Japanese Journal of Applied Physics

Volumn 48, Issue 5 PART 3, 2009, Pages

Innovative architecture of thermal solution for microprocessors

(3) Hu, Chuan a Lu, Daniel D a Vandentop, Gilroy J a

a INTEL CORPORATION (United States)

Author keywords

[No Author keywords available]

Indexed keywords

INTERFACES (MATERIALS); THERMAL INSULATING MATERIALS;

AMBIENTS; BASED MODELLING; CONDITION; HEAT SPREADERS; INTEGRATED HEAT; NON-UNIFORM; POWER; THERMAL INTERFACE MATERIALS; THERMAL PERFORMANCE; THERMAL SOLUTION;

FINITE ELEMENT METHOD;

EID: 70249103841 PISSN: 00214922 EISSN: 13474065 Source Type: Journal
DOI: 10.1143/jjap.48.05ea02 Document Type: Article

Times cited : (2)

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