Measurement of solder/copper interfacial thermal resistance by the flash technique

International Journal of Thermophysics

Volumn 26, Issue 5, 2005, Pages 1607-1615

  Bai, J G ^a,b   Zhang, Z Z ^a,b   Lu, G Q ^a,b   Hasselman, D P H ^b  

^a VIRGINIA POLYTECHNIC INSTITUTE AND STATE UNIVERSITY   (United States)

^b Virginia Polytechnic Institute and State University   (United States)

Author keywords

Finite element analysis; Flash technique; Interfacial thermal resistance; Scanning acoustic microscopy; Transient thermal analysis

Indexed keywords

BONDING; COPPER; FINITE ELEMENT METHOD; INTERFACES (MATERIALS); SOLDERING ALLOYS; THERMOANALYSIS;

FLASH TECHNIQUE; INTERFACIAL THERMAL RESISTANCE; SCANNING ACOUSTIC MICROSCOPY; TRANSIENT THERMAL ANALYSIS;

HEAT RESISTANCE;

EID: 27844542834     PISSN: 0195928X     EISSN: None     Source Type: Journal    
DOI: 10.1007/s10765-005-8107-4     Document Type: Article

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