Crack growth calculations in solder joints based on microstructural phenomena with X-FEM

Computational Materials Science

Volumn 50, Issue 3, 2011, Pages 1145-1156

  Menk, Alexander ^a,b   Bordas, Stéphane P A ^c  

^a UNIVERSITY OF GLASGOW   (United Kingdom)

^b ROBERT BOSCH GMBH   (Germany)

^c CARDIFF UNIVERSITY   (United Kingdom)

Author keywords

Crack growth; Enrichment; Microstructure; Polycrystal fracture; Solder joint; X FEM

Indexed keywords

CRACK GROWTH; ELECTRONIC DEVICE; ENRICHMENT; EXPERIMENTAL DATA; EXTENDED FINITE ELEMENT METHOD; FATIGUE PROCESS; MICROSTRUCTURAL PHENOMENON; NUMERICAL EXAMPLE; RANDOM MICROSTRUCTURE; SOLDER JOINTS; STRUCTURAL PROBLEMS; THERMO MECHANICAL LOADS; X-FEM;

CRACKS; FINITE ELEMENT METHOD; FRACTURE; MICROSTRUCTURE; POLYCRYSTALS;

CRACK PROPAGATION;

EID: 78650711396     PISSN: 09270256     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.commatsci.2010.11.014     Document Type: Article

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