Hybrid low temperature wafer bonding and direct electrical interconnection of 3D MEMS

Procedia Engineering

Volumn 5, Issue , 2010, Pages 902-905

  Kuhne S ^a   Hierold, Ch ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

3D MEMS; AuSn eutectic bonding; Direct bonding; Hybrid wafer bonding; Vertical interconnect

Indexed keywords

BONDING; ELECTRIC POWER SYSTEM INTERCONNECTION; ELECTRONICS PACKAGING; EUTECTICS; HYBRID MATERIALS; INTEGRATED CIRCUIT INTERCONNECTS; INTEGRATION; LOW TEMPERATURE OPERATIONS; SILICON WAFERS; TEMPERATURE; THREE DIMENSIONAL INTEGRATED CIRCUITS; TIN ALLOYS;

3-D MEMS; DIRECT BONDING; ELECTRICAL INTERCONNECTIONS; EUTECTIC BONDING; FABRICATION TECHNOLOGIES; INTERCONNECTION TECHNOLOGY; LOW TEMPERATURE WAFER BONDING; VERTICAL INTERCONNECT;

WAFER BONDING;

EID: 78650613939     PISSN: None     EISSN: 18777058     Source Type: Conference Proceeding    
DOI: 10.1016/j.proeng.2010.09.255     Document Type: Conference Paper

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