Thin-layer Au-Sn solder bonding process for wafer-level packaging, electrical interconnections and MEMS applications

Proceedings of the 2009 IEEE International Interconnect Technology Conference, IITC 2009

Volumn , Issue , 2009, Pages 128-130

  Belov, N ^a   Chou, T K ^a   Heck, J ^b   Kornelsen, K ^c   Spicer, D ^c   Akhlaghi, S ^c   Wang, M ^a   Zhu, T ^a  

^a Nanochip Inc   (United States)

^b INTEL CORPORATION   (United States)

^c Micralyne ^*  (United States)

Author keywords

Adhesion layer; AuSn solder; Bond gap control; Electrical interconnects; Low stress bonding; Sealing; Solder wetting; Thin bond line; Wafer bonding

Indexed keywords

ADHESION LAYER; AUSN SOLDER; BOND GAP CONTROL; ELECTRICAL INTERCONNECTS; LOW STRESS BONDING; SEALING; SOLDER WETTING; THIN BOND LINE;

ADHESION; BOND STRENGTH (MATERIALS); ELECTRIC CONNECTORS; ELECTRONICS PACKAGING; GOLD; TIN; TIN ALLOYS; WETTING;

WAFER BONDING;

EID: 70349449879     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IITC.2009.5090361     Document Type: Conference Paper

References (6)

1. S. Farrens "Precision Wafer to Wafer Packaging using Eutectic Metal Bonding", Proc. SMTA Pan Pacific Microelectronic Symposium, Jan 2008, Kauaii, Hawaii.
2. J. Heck, L. Arana, W. Read, and T. Dory, "Ceramic Via Wafer-Level Packaging for MEMS," ASME InterPack 2005, San Francisco, CA, July 17-22 2005.
3. th International Conf. on Electronic Packaging Technology, 2006.
4. W. Zhang, W. Ruythooren, "Study of the Au/In Reaction for Transient Liquid-Phase Bonding and 3D Chip Stacking", J. Electronic Materials, v.37, No. 8, pp. 1095-1101, 2008.
5. P. Zavracky, V. Bao "Patterned Eutectic Bonding with Al/Ge films for MEMS", Proc. SPIE, v. 2639, p. 46-52, Micromachining and Microfabrication Process Technology, Ed. K. Markus, 1995.
6. H. S. Chen, D. D. Bacon, C. H. Chen, G. Kammlott, G. K. Jeng, D. J. Werder, and K. L. Tai, "Simple Nb metal bonding structure," Applied Physics Letters 66 (17), pp. 2191-4 (1995).