Low temperature fabrication process for high-aspect-ratio and multi-compliant mems

Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)

Volumn , Issue , 2009, Pages 673-676

  Kuihne S ^a   Blattmann, R ^a   Hierold, Ch ^a  

^a ETH ZURICH   (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

3-DIMENSIONAL; DIRECT BONDING; FABRICATION PROCESS; HIGH ASPECT RATIO; HIGH ASPECT RATIO MICROSTRUCTURES; LAYER TRANSFER; LOW TEMPERATURE PLASMAS; LOW-TEMPERATURE FABRICATION; MATERIAL PROPERTY; MICRO MIRROR; MULTIPLE MATERIALS; ON-WAFER; OPTICAL DEFLECTION ANGLE; POLYMERIC SUSPENSIONS; PROCESS FLOWS; PROCESS TECHNOLOGIES; VERTICAL COMB-DRIVE ACTUATOR;

FABRICATION; MEMS; MICROELECTROMECHANICAL DEVICES; PHOTORESISTS; SILICON WAFERS; WAFER BONDING;

ASPECT RATIO;

EID: 65949112273     PISSN: 10846999     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/MEMSYS.2009.4805472     Document Type: Conference Paper

References (8)

1. Q.-Y. Tong and U. M. Gosele, "Wafer bonding and layer splitting for microsystems," Adv. Materials, vol.11, pp. 1409-1425, 12 1999. (Pubitemid 129675576)
2. H. Baltes and 0. Brand, "CMOS-based microsensors and packaging," Sensors and Actuators A: Physical, vol.92, pp. 1-9, 2001.
3. S. N. Farrens, J. R. Dekker, J. K. Smith, and B. E. Roberds, "Chemical Free Room-Temperature Wafer to Wafer Direct Bonding," J. Electrochem. Soc., vol.142, pp. 3949-3955, Nov 1995.
4. 2," J. Electrochem. Soc., vol.149, pp. G348-G351, 2002. (Pubitemid 34697454)
5. T. Qin-Yi, T. Qin-Yi, G. Cha, R. Gafiteanu, and U. A. G. U. Gosele, "Low temperature wafer direct bonding," J. Microelectromech. Syst., vol.3, pp. 29-35, 1994.
6. D. Bachmann, S. Kuhne, and C. Hierold, "MEMS scanning mirror supported by soft polymeric springs and actuated by electrostatic charge separation," in Proc. MEMS 2007, pp. 723-726.
7. J. Yeom, Y. Wu, J. C. Selby, and M. A. Shannon, "Maximum achievable aspect ratio in deep reactive ion etching of silicon due to aspect ratio dependent transport and the microloading effect," J. Vac. Sci. Technol. B, vol.23, pp. 2319-2329, Nov-Dec 2005.
8. W. P. Maszara, G. Goetz, A. Caviglia, and J. B. McKitterick, "Bonding of silicon wafers for silicon-oninsulator," Journal of Applied Physics, vol.64, pp. 4943-4950, 1988.