Effect of the aluminium content and the bias voltage on the microstructure formation in Ti1-xAlxN protective coatings grown by cathodic arc evaporation

Surface and Coatings Technology

Volumn 205, Issue 5, 2010, Pages 1345-1349

  Wüstefeld, Ch ^a   Rafaja, D ^a   Klemm, V ^a   Michotte, C ^b   Kathrein, M ^c  

^a TU BERGAKADEMIE FREIBERG   (Germany)

^b Ceratizit Luxembourg Sàrl ^*  (Luxembourg)

^c CERATIZIT AUSTRIA GMBH   (Austria)

Author keywords

(Ti,Al)N nanocomposites; Bias voltage; Cathodic arc evaporation; X ray diffraction

Indexed keywords

(TI,AL)N NANOCOMPOSITES; AL-CONCENTRATION; ALN; ALUMINIUM CONTENT; CATHODIC ARC; CATHODIC ARC EVAPORATION; CHEMICAL COMPOSITIONS; COMPRESSIVE RESIDUAL STRESS; FACE-CENTRED CUBIC; HIGH CONCENTRATION; INDENTATION HARDNESS; LOCAL DISTRIBUTIONS; LOCAL FLUCTUATIONS; MICROSTRUCTURE FORMATION; PHASE SEGREGATIONS;

ALUMINUM; CRYSTALLITE SIZE; DIFFRACTION; EVAPORATION; HARDNESS; MICROSTRUCTURE; NANOCOMPOSITES; PHASE COMPOSITION; PHASE SEPARATION; PROTECTIVE COATINGS; RESIDUAL STRESSES; TRANSMISSION ELECTRON MICROSCOPY; X RAY DIFFRACTION; X RAY DIFFRACTION ANALYSIS; X RAYS;

BIAS VOLTAGE;

EID: 78649980074     PISSN: 02578972     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.surfcoat.2010.07.057     Document Type: Article

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