Adhesive strength of flip chip packages

International Journal of Adhesion and Adhesives

Volumn 28, Issue 3, 2008, Pages 109-119

  Chiang, W K ^a   Chan, Y C ^a   Ralph, Brian ^b   Holland, Andew ^b  

^a CITY UNIVERSITY OF HONG KONG   (Hong Kong)

^b BRUNEL UNIVERSITY   (United Kingdom)

Author keywords

A. Epoxy; B. Interfaces; D. Aging; Flip chip packages

Indexed keywords

AGING OF MATERIALS; BOND STRENGTH (MATERIALS); DEGRADATION; EPOXY RESINS; FAILURE (MECHANICAL); HYDROLYSIS; INTERFACES (MATERIALS); POLYIMIDES;

MECHANICAL BEHAVIOR; MODULUS LOSSES; NON CONDUCTIVE ADHESIVE (NCA) JOINTS; POLYIMIDE INTERFACES; TESTING ENVIRONMENTS;

FLIP CHIP DEVICES;

EID: 38349095600     PISSN: 01437496     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.ijadhadh.2007.02.007     Document Type: Article

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