Temperature dependence of electrical resistivity of isotropic conductive adhesive composed of an epoxy-based binder

Proceedings of International Symposium on High Density Packaging and Microsystem Integration 2007, HDP'07

Volumn , Issue , 2007, Pages

  Inoue, Masahiro ^a   Muta, Hiroaki ^a   Yamanaka, Shinsuke ^a   Suganuma, Katsuaki ^a  

^a OSAKA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

BINDERS; ELECTRIC CONDUCTIVITY; EPOXY RESINS; HIGH TEMPERATURE EFFECTS;

EPOXY-BASED BINDERS; ISOTROPIC CONDUCTIVE ADHESIVE (ICA); TEMPERATURE DEPENDENCE;

ADHESIVES;

EID: 41049098083     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/HDP.2007.4283581     Document Type: Conference Paper

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