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Thin Solid Films

Volumn 519, Issue 4, 2010, Pages 1380-1386

Orientation relationships, interfaces, and microstructure of η-Cu 6Sn5 formed in the early-stage reaction between Cu and molten Sn

(3) Wang, Kuang Kuo a Gan, Dershin a Hsieh, Ker Chang a

a NATIONAL SUN YAT SEN UNIVERSITY (Taiwan)

Author keywords

Cu6Sn5; Copper; Interface; Orientation relationship; Tin; Transmission electron microscopy

Indexed keywords

CU FOIL; ICE WATER; INTERFACE; ORIENTATION RELATIONSHIP; TEM; TRANSMISSION ELECTRON;

METAL CLADDING; TRANSMISSION ELECTRON MICROSCOPY;

TIN;

EID: 78349307828 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/j.tsf.2010.09.045 Document Type: Article

Times cited : (17)

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