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Volumn , Issue , 2010, Pages 229-232

Highly-scalable 3D CLOS NOC for many-core CMPs

Author keywords

3D IC; CLOS; Network on chip; VLSI

Indexed keywords

3D IC; 3D MESHES; CHIP MULTIPROCESSORS; CLOS; CLOS NETWORKS; LOW POWER; MANY-CORE; NETWORK ON CHIP; POWER CONSUMPTION; PROCESSING ELEMENTS; VLSI;

EID: 78349301604     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/NEWCAS.2010.5603776     Document Type: Conference Paper
Times cited : (13)

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    • Li, F.1    Nicopoulos, C.2    Richardson, T.3    Xie, Y.4    Narayanan, V.5    Kandemir, M.6
  • 9
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    • B. Feero and P. Pande, "Networks-on-Chip in Three-Dimensional Environment: A Performance Evaluation," IEEE Trans. on Computers, vol.58, no.1, pp.32-45, Jan.2009.
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.