-
2
-
-
63549132928
-
-
APPLAB 0003-6951,. 10.1063/1.3108088
-
K. M. Kim and C. S. Hwang, Appl. Phys. Lett. APPLAB 0003-6951 94, 122109 (2009). 10.1063/1.3108088
-
(2009)
Appl. Phys. Lett.
, vol.94
, pp. 122109
-
-
Kim, K.M.1
Hwang, C.S.2
-
3
-
-
41349114618
-
2 cells
-
DOI 10.1063/1.2903707
-
C. Schindler, M. Weides, M. N. Kozicki, and R. Waser, Appl. Phys. Lett. APPLAB 0003-6951 92, 122910 (2008). 10.1063/1.2903707 (Pubitemid 351451666)
-
(2008)
Applied Physics Letters
, vol.92
, Issue.12
, pp. 122910
-
-
Schindler, C.1
Weides, M.2
Kozicki, M.N.3
Waser, R.4
-
4
-
-
33748997398
-
A low-power nonvolatile switching element based on copper-tungsten oxide solid electrolyte
-
DOI 10.1109/TNANO.2006.880407, 1695953
-
M. N. Kozicki, C. Gopalan, M. Balakrishnan, and M. Mitkova, IEEE Trans. Nanotechnol. ZZZZZZ 1536-125X 5, 535 (2006). 10.1109/TNANO.2006.880407 (Pubitemid 44444396)
-
(2006)
IEEE Transactions on Nanotechnology
, vol.5
, Issue.5
, pp. 535-544
-
-
Kozicki, M.N.1
Gopalan, C.2
Balakrishnan, M.3
Mitkova, M.4
-
5
-
-
67650102619
-
-
ADVMEW 0935-9648,. 10.1002/adma.200900375
-
R. Waser, R. Dittmann, G. Staikov, and K. Szot, Adv. Mater. ADVMEW 0935-9648 21, 2632 (2009). 10.1002/adma.200900375
-
(2009)
Adv. Mater.
, vol.21
, pp. 2632
-
-
Waser, R.1
Dittmann, R.2
Staikov, G.3
Szot, K.4
-
6
-
-
63749096418
-
-
JAPIAU 0021-8979,. 10.1063/1.3055414
-
B. Sun, Y. X. Liu, L. F. Liu, N. Xu, Y. Wang, X. Y. Liu, R. Q. Han, and J. F. Kang, J. Appl. Phys. JAPIAU 0021-8979 105, 061630 (2009). 10.1063/1.3055414
-
(2009)
J. Appl. Phys.
, vol.105
, pp. 061630
-
-
Sun, B.1
Liu, Y.X.2
Liu, L.F.3
Xu, N.4
Wang, Y.5
Liu, X.Y.6
Han, R.Q.7
Kang, J.F.8
-
7
-
-
34247561316
-
2 film memory devices
-
DOI 10.1109/LED.2007.894652
-
C. Lin, C. Wu, C. Wu, T. Lee, F. Yang, C. Hu, and T. Tseng, IEEE Electron Device Lett. EDLEDZ 0741-3106 28, 366 (2007). 10.1109/LED.2007.894652 (Pubitemid 46667430)
-
(2007)
IEEE Electron Device Letters
, vol.28
, Issue.5
, pp. 366-368
-
-
Lin, C.-Y.1
Wu, C.-Y.2
Wu, C.-Y.3
Lee, T.-C.4
Yang, F.-L.5
Hu, C.6
Tseng, T.-Y.7
-
8
-
-
42149174364
-
Electrical evidence of unstable anodic interface in RuHf Ox TiN unipolar resistive memory
-
DOI 10.1063/1.2908928
-
H. Y. Lee, P. S. Chen, T. Y. Wu, C. C. Wang, P. J. Tzeng, C. H. Lin, F. Chen, M. J. Tsai, and C. Lien, Appl. Phys. Lett. APPLAB 0003-6951 92, 142911 (2008). 10.1063/1.2908928 (Pubitemid 351535634)
-
(2008)
Applied Physics Letters
, vol.92
, Issue.14
, pp. 142911
-
-
Lee, H.Y.1
Chen, P.S.2
Wu, T.Y.3
Wang, C.C.4
Tzeng, P.J.5
Lin, C.H.6
Chen, F.7
Tsai, M.-J.8
Lien, C.9
-
9
-
-
67649538428
-
-
JAPIAU 0021-8979,. 10.1063/1.3139282
-
Ch. Walczyk, Ch. Wenger, R. Soha, M. Lukosius, A. Fox, J. Dabrowski, D. Wolansky, B. Tillack, H. -J. Mussig, and T. Schroeder, J. Appl. Phys. JAPIAU 0021-8979 105, 114103 (2009). 10.1063/1.3139282
-
(2009)
J. Appl. Phys.
, vol.105
, pp. 114103
-
-
Walczyk, Ch.1
Wenger, Ch.2
Soha, R.3
Lukosius, M.4
Fox, A.5
Dabrowski, J.6
Wolansky, D.7
Tillack, B.8
Mussig, H.-J.9
Schroeder, T.10
-
10
-
-
67650733296
-
-
APPLAB 0003-6951,. 10.1063/1.3176977
-
Q. Liu, C. Dou, Y. Wang, S. Long, W. Wang, M. Liu, M. Zhang, and J. Chen, Appl. Phys. Lett. APPLAB 0003-6951 95, 023501 (2009). 10.1063/1.3176977
-
(2009)
Appl. Phys. Lett.
, vol.95
, pp. 023501
-
-
Liu, Q.1
Dou, C.2
Wang, Y.3
Long, S.4
Wang, W.5
Liu, M.6
Zhang, M.7
Chen, J.8
-
11
-
-
71049184870
-
-
DTPTEW 0743-1562.
-
B. Gao, H. Zhang, S. Yu, B. Sun, L. Liu, X. Liu, Y. Wang, R. Han, J. Kang, B. Yu, and Y. Wang, Dig. Tech. Pap.-Symp. VLSI Technol. DTPTEW 0743-1562 2009, 30.
-
Dig. Tech. Pap. - Symp. VLSI Technol.
, vol.2009
, pp. 30
-
-
Gao, B.1
Zhang, H.2
Yu, S.3
Sun, B.4
Liu, L.5
Liu, X.6
Wang, Y.7
Han, R.8
Kang, J.9
Yu, B.10
Wang, Y.11
-
12
-
-
43349101629
-
-
ADVMEW 0935-9648,. 10.1002/adma.200702024
-
S. C. Chae, J. S. Lee, S. Kim, S. B. Lee, S. H. Chang, C. Liu, B. Kahng, H. Shin, D. -W. Kim, C. U. Jung, S. Seo, M. -J. Lee, and T. W. Noh, Adv. Mater. ADVMEW 0935-9648 20, 1154 (2008). 10.1002/adma.200702024
-
(2008)
Adv. Mater.
, vol.20
, pp. 1154
-
-
Chae, S.C.1
Lee, J.S.2
Kim, S.3
Lee, S.B.4
Chang, S.H.5
Liu, C.6
Kahng, B.7
Shin, H.8
Kim, D.-W.9
Jung, C.U.10
Seo, S.11
Lee, M.-J.12
Noh, T.W.13
-
13
-
-
67349254824
-
-
EDLEDZ 0741-3106,. 10.1109/LED.2009.2015687
-
J. Yoon, H. Choi, D. Lee, J. -B. Park, J. Lee, D. -J. Seong, Y. Ju, M. Chang, S. Jung, and H. Hwang, IEEE Electron Device Lett. EDLEDZ 0741-3106 30, 457 (2009). 10.1109/LED.2009.2015687
-
(2009)
IEEE Electron Device Lett.
, vol.30
, pp. 457
-
-
Yoon, J.1
Choi, H.2
Lee, D.3
Park, J.-B.4
Lee, J.5
Seong, D.-J.6
Ju, Y.7
Chang, M.8
Jung, S.9
Hwang, H.10
-
14
-
-
59849106836
-
-
APPLAB 0003-6951,. 10.1063/1.3078824
-
P. Zhou, M. Yin, H. J. Wan, H. B. Lu, T. A. Tang, and Y. Y. Lin, Appl. Phys. Lett. APPLAB 0003-6951 94, 053510 (2009). 10.1063/1.3078824
-
(2009)
Appl. Phys. Lett.
, vol.94
, pp. 053510
-
-
Zhou, P.1
Yin, M.2
Wan, H.J.3
Lu, H.B.4
Tang, T.A.5
Lin, Y.Y.6
-
16
-
-
33750428912
-
2/Ru stacked structures
-
DOI 10.1149/1.2353899
-
K. M. Kim, B. J. Choi, B. W. Koo, S. Choi, D. S. Jeong, and C. S. Hwang, Electrochem. Solid-State Lett. ESLEF6 1099-0062 9, G343 (2006). 10.1149/1.2353899 (Pubitemid 44652658)
-
(2006)
Electrochemical and Solid-State Letters
, vol.9
, Issue.12
, pp. 343-346
-
-
Kim, K.M.1
Choi, B.J.2
Koo, B.W.3
Choi, S.4
Jeong, D.S.5
Hwang, C.S.6
|