Evaluating solder paste behaviours through rheological test methods and their correlation to the printing performance

Soldering and Surface Mount Technology

Volumn 22, Issue 4, 2010, Pages 42-49

  Mallik, S ^a   Schmidt, M ^b   Bauer, R ^b   Ekere, N N ^a  

^a UNIVERSITY OF GREENWICH   (United Kingdom)

^b UNIVERSITY OF APPLIED SCIENCES DRESDEN   (Germany)

Author keywords

Flipchips; Rheology; Solder paste; Viscosity

Indexed keywords

ALLOY COMPOSITIONS; CREEP-RECOVERY TEST; DESIGN/METHODOLOGY/APPROACH; EFFECT OF TEMPERATURE; FLIP CHIP; FLIP CHIP ASSEMBLIES; FLOW BEHAVIOURS; FLUX COMPOSITION; LEAD-FREE SOLDER PASTE; METAL CONTENT; PRINTING PERFORMANCE; PROCESS OPTIMIZATION; PRODUCTION YIELD; RHEOLOGICAL BEHAVIOUR; RHEOLOGICAL CHARACTERIZATION; RHEOLOGICAL PROPERTY; RHEOLOGICAL TEST; SHEAR THINNING; SOLDER PASTE; STENCIL PRINTING; VISCOSITY TESTS; YIELD STRESS VALUE;

CREEP; CREEP TESTING; ELASTICITY; FLIP CHIP DEVICES; FLOW FIELDS; FLUID DYNAMICS; METAL RECOVERY; OPTIMIZATION; PRINTING; PRINTING PRESSES; PRODUCT DEVELOPMENT; RHEOLOGY; TESTING; VISCOSITY;

YIELD STRESS;

EID: 77957555070     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540911011076871     Document Type: Article

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