Effect of Ag content on wetting properties and solidus temperature of Sn-8.5Zn-xAg-0.01Al-0.1Ga lead-free solders

Soldering and Surface Mount Technology

Volumn 20, Issue 1, 2008, Pages 22-26

  Lai, R S ^a   Lin, K L ^a   Salam, B ^a  

^a NATIONAL CHENG KUNG UNIVERSITY   (Taiwan)

Author keywords

Silver; Soldering; Solders; Time

Indexed keywords

DIFFERENTIAL SCANNING CALORIMETRY; ENERGY DISPERSIVE X RAY ANALYSIS; MELTING POINT; SOLDERING ALLOYS; TIN COMPOUNDS; WETTING;

MULTI-INTERMETALLIC LAYERS; WETTING FORCES; WETTING PROPERTIES;

SILVER COMPOUNDS;

EID: 40249091490     PISSN: 09540911     EISSN: None     Source Type: Journal    
DOI: 10.1108/09540910810861459     Document Type: Article

References (7)

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7. Yu, C.-H. and Lin, K.-L. (2005), "Early stage soldering reaction and interfacial microstructure formed between molten Sn-Zn-Ag solder and Cu substrate", Journal of Materials Research, Vol. 20 No. 5, pp. 1242-9.