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Volumn , Issue , 2007, Pages 165-171
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A study of the rheological properties of lead free solder paste formulations used for flip-chip interconnection
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Author keywords
[No Author keywords available]
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Indexed keywords
BRAZING;
ELECTRIC CURRENTS;
ELECTRONIC EQUIPMENT;
ELECTRONIC EQUIPMENT MANUFACTURE;
FLIP CHIP DEVICES;
MATERIALS PROPERTIES;
PRINTED CIRCUIT BOARDS;
PRINTED CIRCUIT MANUFACTURE;
PRINTED CIRCUITS;
PRODUCTION ENGINEERING;
RHEOLOGY;
SOLDERED JOINTS;
SOLDERING;
SOLDERING ALLOYS;
TECHNOLOGY;
WALLS (STRUCTURAL PARTITIONS);
WASTEWATER TREATMENT;
WELDING;
CHARACTERISATION;
ELECTRONIC COMPONENTS;
ELECTRONICS MANUFACTURING;
ELECTRONICS SECTORS;
END USERS;
ENVIRONMENTALLY-FRIENDLY;
EQUIPMENT CHARACTERISTICS;
EQUIPMENT SUPPLIERS;
FLIP CHIP INTERCONNECTIONS;
FLIP CHIPPING;
FLIP-CHIP ASSEMBLIES;
LEAD-FREE SOLDER PASTES;
LEAD-FREE SOLDERING;
PARALLEL-PLATE GEOMETRY;
PLATE GEOMETRIES;
PROCESS ENGINEERS;
PRODUCT PERFORMANCES;
PRODUCT QUALITIES;
RHEOLOGICAL BEHAVIOUR;
RHEOLOGICAL MEASUREMENTS;
RHEOLOGICAL PROPERTIES;
RHEOLOGICAL TESTING;
SOLDER INTERCONNECTS;
SOLDER PASTES;
STRESS-SWEEP MEASUREMENT;
VISCO-ELASTIC;
WALL-SLIP EFFECTS;
LEAD;
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EID: 48149114495
PISSN: 10898190
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/IEMT.2007.4417065 Document Type: Conference Paper |
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Times cited : (4)
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References (9)
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