SCOPUS 정보 검색 플랫폼

Volumn 58, Issue 19, 2010, Pages 6294-6305

Formation of a high-cycle fatigue fracture surface and a crack growth mechanism of ultrafine-grained copper with different stages of microstructural evolution

(6) Goto, M a Han, S Z b Euh, K b Kang, J H b Kim, S S c Kawagoishi, N d

a OITA UNIVERSITY (Japan)

b Korea Institute of Material Science (South Korea)

c Gyeongsang National University (South Korea)

d KAGOSHIMA UNIVERSITY (Japan)

Author keywords

Copper; Equal channel angular pressing; Fatigue crack; Fracture surface; Misorientation

Indexed keywords

CRACK GROWTH BEHAVIOR; CRACK GROWTH RATES; CRACK-GROWTH MECHANISMS; EQUAL CHANNEL ANGULAR; FATIGUE CRACKS; FATIGUE CYCLING; FATIGUE TESTS; FRACTURE SURFACE; FRACTURE SURFACE MORPHOLOGY; FRACTURE SURFACES; GROWTH BEHAVIOR; HIGH-CYCLE FATIGUES; MICROSTRUCTURAL FACTORS; MIS-ORIENTATION; PLASTIC ZONE SIZE; QUANTITATIVE MODELS; SURFACE FORMATION; ULTRAFINE-GRAINED COPPER;

COPPER; DROPS; EQUAL CHANNEL ANGULAR PRESSING; FATIGUE CRACK PROPAGATION; FATIGUE OF MATERIALS; FATIGUE TESTING; FRACTURE; HYDROGEN EMBRITTLEMENT; PRESSING (FORMING);

CRACKS;

EID: 77957154299 PISSN: 13596454 EISSN: None Source Type: Journal
DOI: 10.1016/j.actamat.2010.07.051 Document Type: Article

Times cited : (44)

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