The effect of microstructural inhomogeneity on the growth paths of surface-cracks in copper processed by equal channel angular pressing

Engineering Fracture Mechanics

Volumn 77, Issue 11, 2010, Pages 1914-1925

  Goto, M ^a   Ando, Y ^a   Han, S Z ^b   Kim, S S ^c   Kawagoishi, N ^d   Euh, K ^b  

^a OITA UNIVERSITY   (Japan)

^b Korea Institute of Material Science   (South Korea)

^c Gyeongsang National University   (South Korea)

^d KAGOSHIMA UNIVERSITY   (Japan)

Author keywords

Copper; Crack propagation; Fatigue; Fracture surface; Ultrafine grain

Indexed keywords

CRACK GROWTH; CRACK LENGTH; CRACK-GROWTH MECHANISMS; FATIGUE FRACTURE; FRACTURE SURFACE; FRACTURE SURFACES; GROWTH BEHAVIOR; GROWTH PATHS; HIGH STRESS; LOW STRESS; MICROSTRUCTURAL INHOMOGENEITY; STRESS AMPLITUDES; ULTRA FINE GRAIN; ULTRAFINE-GRAINED COPPER;

COPPER; CRACK PROPAGATION; EQUAL CHANNEL ANGULAR PRESSING; FRACTURE; HYDROGEN EMBRITTLEMENT; PRESSING (FORMING); SCANNING ELECTRON MICROSCOPY;

CRACKS;

EID: 77954175865     PISSN: 00137944     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.engfracmech.2010.01.011     Document Type: Article

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