Growth mechanism of a small surface crack of ultrafine-grained copper in a high-cycle fatigue regime

Scripta Materialia

Volumn 60, Issue 8, 2009, Pages 729-732

  Goto, M ^a   Han, S Z ^b   Kim, S S ^c   Ando, Y ^a   Kawagoishi, N ^d  

^a OITA UNIVERSITY   (Japan)

^b Korea Institute of Material Science   (South Korea)

^c Gyeongsang National University   (South Korea)

^d KAGOSHIMA UNIVERSITY   (Japan)

Author keywords

Copper; Equal channel angular pressing; Fatigue test; Reversible plastic zone; Small crack

Indexed keywords

COPPER; CRACK TIPS; CRACKING (CHEMICAL); CRACKS; FATIGUE TESTING; GRAIN GROWTH; GROWTH (MATERIALS); METAL PRESSING; PRESSING (FORMING);

AFTER INITIATIONS; CRACK LENGTHS; CRACK-GROWTH MECHANISMS; CRACK-TIP; FATIGUE TEST; GRAIN SIZES; GROWTH BEHAVIORS; GROWTH MECHANISMS; GROWTH PATHS; HIGH- CYCLE FATIGUES; PLASTIC ZONE SIZES; REVERSIBLE PLASTIC ZONE; SHEAR DIRECTIONS; SMALL CRACK; SURFACE CRACKS; ULTRA-FINE GRAINED COPPERS;

EQUAL CHANNEL ANGULAR PRESSING;

EID: 60249085285     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2009.01.003     Document Type: Article

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