Significance of non-equilibrium grain boundaries in surface damage formation of ultrafine-grained copper in high-cycle fatigue

Scripta Materialia

Volumn 57, Issue 4, 2007, Pages 293-296

  Goto, M ^a   Han, S Z ^b   Kim, S S ^c   Kawagoishi, N ^d   Lim, C Y ^b  

^a OITA UNIVERSITY   (Japan)

^b Korea Institute of Machine and Materials   (South Korea)

^c Gyeongsang National University   (South Korea)

^d KAGOSHIMA UNIVERSITY   (Japan)

Author keywords

Copper; Equal channel angular pressing; Fatigue; Grain boundaries; Mild heat treatment

Indexed keywords

EQUAL CHANNEL ANGULAR PRESSING; FATIGUE OF MATERIALS; GRAIN BOUNDARIES; HARDNESS; HEAT TREATMENT; MICROSTRUCTURE;

ANGULAR PRESSING; MILD HEAT TREATMENT; ULTRAFINE-GRAINED COPPER;

COPPER;

EID: 34249995740     PISSN: 13596462     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.scriptamat.2007.04.040     Document Type: Article

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