Microstructural changes produced by fatigue in high-purity copper severely deformed by cryogenic rolling

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 40, Issue 10, 2009, Pages 2255-2263

  Zhang, Kai ^a,b   Weertman, J R ^a  

^a Northwestern University   (United States)

^b Diamond Innovations   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AVERAGE GRAIN SIZE; FATIGUE LIFE; GRAIN SIZE; HIGH-PURITY; INTERNAL STRAINS; LOW TEMPERATURES; LOWER STRESS; MICROSTRUCTURAL CHANGES; PARALLEL DISLOCATIONS; PLASTIC STRAIN; REDUCTION IN AREA; SAMPLE SURFACE; TEM; TENSION-TENSION;

GRAIN SIZE AND SHAPE; ROLLING; STRAIN; TRANSMISSION ELECTRON MICROSCOPY;

GRAIN GROWTH;

EID: 69949145984     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11661-009-9925-y     Document Type: Article

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