Ultrasonic friction power during thermosonic Au and Cu ball bonding

Journal of Physics D: Applied Physics

Volumn 43, Issue 32, 2010, Pages

  Shah, A ^a   Mayer, M ^a   Qin, I ^b   Huynh, C ^b   Zhou, Y ^a   Meyer, M ^b  

^a UNIVERSITY OF WATERLOO   (Canada)

^b Kulicke and Soffa Industries Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

AVERAGE ERRORS; BALL BONDING; BOND INTERFACE; BOND PROCESS; BONDING CAPILLARY; BONDING PROCESS; CU PROCESS; CU WIRES; EXPERIMENTAL DATA; EXPERIMENTAL MEASUREMENTS; FRICTION ENERGY; IMPROVED METHODS; INTERFACIAL FRICTION; INTERFACIAL SLIDING; MAXIMUM VALUES; MECHANICAL COMPLIANCE; OPTIMUM VALUE; PIEZO-RESISTIVE; RELATIVE AMPLITUDE; RELATIVE MOTION; SLIDING FRICTION; TANGENTIAL FORCE; THERMOSONIC BALL BONDING; THERMOSONICS; ULTRASONIC SYSTEM; VIBRATION AMPLITUDE;

FRICTION; SPHERES; TRIBOLOGY; ULTRASONIC TRANSDUCERS;

ULTRASONICS;

EID: 77957092506     PISSN: 00223727     EISSN: 13616463     Source Type: Journal    
DOI: 10.1088/0022-3727/43/32/325301     Document Type: Article

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