On the microcontact mechanism of thermosonic wire bonding in microelectronics: Saturation of interfacial phenomena

Tribology Transactions

Volumn 48, Issue 1, 2005, Pages 127-132

  Jeng, Yeau Ren ^a   Chen, J Y ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

Energy intensity; Interfacial phenomena; Thermosonic; Wire bonding

Indexed keywords

BONDING; INTERFACES (MATERIALS); SHEAR STRESS; SURFACE CHEMISTRY; THERMAL EFFECTS; ULTRASONICS; WELDING; WIRE; INTEGRATED CIRCUITS; TEMPERATURE DISTRIBUTION;

INTERFACIAL TEMPERATURE; MICROCONTACT MECHANISM; SATURATED ENERGY INTENSITY; THERMOSONIC WIRE BONDING; ENERGY INTENSITY; INTERFACIAL PHENOMENA; THERMOSONICS; WIRE BONDING;

MICROELECTRONICS;

MICROELECTRONICS;

EID: 13844305836     PISSN: 10402004     EISSN: None     Source Type: Journal    
DOI: 10.1080/05698190590903114     Document Type: Article

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