A footprint study of bond initiation in gold wire crescent bonding

IEEE Transactions on Components and Packaging Technologies

Volumn 28, Issue 4, 2005, Pages 810-816

  Zhou, Y ^a   Li, X ^a   Noolu, Narenda J ^b  

^a UNIVERSITY OF WATERLOO   (Canada)

^b INTEL CORPORATION   (United States)

Author keywords

Bonding force; Bonding mechanisms; Footprint morphology; Gold wire crescent bonding; Substrate temperature; Ultrasonic energy

Indexed keywords

BOND STRENGTH (MATERIALS); BONDING; GOLD; MORPHOLOGY; SHEAR DEFORMATION; SUBSTRATES; ULTRASONIC WAVES; WELDS;

FOOTPRINT MORPHOLOGY; GOLD WIRE CRESCENT BONDING; METALLURGICAL BONDING;

CHIP SCALE PACKAGES;

EID: 29244460989     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/TCAPT.2005.848585     Document Type: Article

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