Study of interfacial phenomena affecting thermosonic wire bonding in microelectronics

Journal of Tribology

Volumn 125, Issue 3, 2003, Pages 576-581

  Jeng, Yeau Ren ^a   Lin, Jeng Nan ^a  

^a NATIONAL CHUNG CHENG UNIVERSITY   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

BONDING; FRICTION; INTEGRATED CIRCUIT MANUFACTURE; ULTRASONICS;

THERMOSONIC WIRE BONDING;

TRIBOLOGY;

BOND STRENGTH;

EID: 0043233235     PISSN: 07424787     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1537265     Document Type: Article

References (11)

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