Fatigue behavior of electrically conductive adhesives

Electrically Conductive Adhesives

Volumn , Issue , 2008, Pages 251-270

  Su, Bin ^a   Qu, Jianmin ^a  

^a GEORGIA INSTITUTE OF TECHNOLOGY   (United States)

Author keywords

Conductive adhesive; Electrical failure; Fatigue

Indexed keywords

EID: 77956961761     PISSN: None     EISSN: None     Source Type: Book    
DOI: None     Document Type: Chapter

References (10)

1. J. H. Constable, T. Kache, H. Teichmann, S. Muhle and M. A. Gaynes, IEEE Trans. Components Packaging Technol. 22, 191-199 (1999).
2. R. L. Keusseyan and J. L. Dilday, Int. J. Microcircuits Electronic Packaging 17, 236-242 (1994).
3. R. Gomatam and E. Sancaktar, in: Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, Braselton, GA, pp. 6-12 (2001).
4. Z. Mo, Z. Lai, S. Li and J. Liu, Soldering Surface Mount Technol. 16, 48-52 (2004).
5. Y. Kitazaki and T. Hata, J. Adhesion 4, 123-133 (1972).
6. E. Sancaktar and P. Zhang, Trans. ASME, J. Mech. Design 112, 605-619 (1990).
7. R. R. Gomatam and E. Sancaktar, J. Adhesion Sci. Technol. 18, 731-750 (2004).
8. R. R. Gomatam and E. Sancaktar, J. Adhesion Sci. Technol. 20, 87-104 (2006).
9. B. Su and J. Qu, in: Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces, Irvine, CA, pp. 75-78 (2005).
10. M. Zwolinski, J. Hickman, H. Rubin, Y. Zaks, S. McCarthy, T. Hanlon, P. Arrowsmith, A. Chaud- huri, R. Hermansen, S. Lau and D. Napp, IEEE Trans. Components Packaging Manuf. Technol. Part C 19, 241-250 (1996).