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Volumn , Issue , 2010, Pages 768-772

New IGBT development for traction drive and wind power

Author keywords

EC diode; IGBT; PrimePACk ; Trench IGBT

Indexed keywords

CELL OPTIMIZATION; CHIP TECHNOLOGY; CURRENT RATING; EC DIODE; HIGH ROBUSTNESS; HIGH-POWER; IGBT; SHORT CIRCUIT; SURGE CURRENT; SWITCHING LOSS; TRACTION DRIVE; TRADE OFF; TRENCH IGBT; VOLTAGE APPLICATIONS;

EID: 77956556256     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IPEC.2010.5543293     Document Type: Conference Paper
Times cited : (13)

References (13)
  • 1
    • 0036053240 scopus 로고    scopus 로고
    • 1700V-IGBT3: Field stop technology with optimized trench structure-trend setting for the high power applications in industry and traction
    • M. Pfaffenlehner, T. Laska, R. Mallwitz, A. Mauder, F. Pfirsch, C. Schaeffer, "1700V-IGBT3: Field Stop Technology with Optimized Trench Structure - Trend setting for The High Power Applications in Industry and Traction," Proc. ISPSD, 2002, pp. 105-109.
    • (2002) Proc. ISPSD , pp. 105-109
    • Pfaffenlehner, M.1    Laska, T.2    Mallwitz, R.3    Mauder, A.4    Pfirsch, F.5    Schaeffer, C.6
  • 2
    • 4944245538 scopus 로고    scopus 로고
    • New 3000Vchip generation with a trench IGBT and an optimized field stop concept with a smoot switching behavior
    • M. Pfaffenlehner, J. Biermann, C. Schaeffer, H. Schulze, "New 3000Vchip Generation with a Trench IGBT and an Optimized Field Stop Concept with a Smoot Switching Behavior," Proc. ISPSD, 2004, pp.107-110.
    • (2004) Proc. ISPSD , pp. 107-110
    • Pfaffenlehner, M.1    Biermann, J.2    Schaeffer, C.3    Schulze, H.4
  • 4
  • 5
    • 84906356341 scopus 로고    scopus 로고
    • On the loss - Softness trade-off: Are different chip versions needed for softness-improvement?
    • M. Bäßler, A. Ciliox, P. Kanschat, "On the loss - softness trade-off: Are different chip versions needed for softness-improvement? " Proc. PCIM, 2009.
    • (2009) Proc. PCIM
    • Bäßler, M.1    Ciliox, A.2    Kanschat, P.3
  • 7
    • 34247544446 scopus 로고    scopus 로고
    • Novel enhanced-planar IGBT technology rated up to 6.5KV for lower losses and higher SOA capability
    • M. Rahimo, A. Kopta, S. Linder, "Novel Enhanced-Planar IGBT Technology Rated up to 6.5KV for Lower Losses and Higher SOA Capability," Proc. ISPSD, 2006, pp. 69-72.
    • (2006) Proc. ISPSD , pp. 69-72
    • Rahimo, M.1    Kopta, A.2    Linder, S.3
  • 8
    • 34247476289 scopus 로고    scopus 로고
    • Source side thermal runaway of trench IGBTs, dependence on design aspects
    • A. Müller-Dauch, F. Pfirsch, M. Pfaffenlehner, D. Silber, "Source Side Thermal Runaway of Trench IGBTs, Dependence on Design Aspects," Proc. ISPSD, 2006, pp. 21-24.
    • (2006) Proc. ISPSD , pp. 21-24
    • Müller-Dauch, A.1    Pfirsch, F.2    Pfaffenlehner, M.3    Silber, D.4
  • 10
    • 39749160380 scopus 로고    scopus 로고
    • 600 V reverse conducting (RC-) IGBT for drives applications in ultra-thin wafer technology
    • H. Ruething, F. Hille, F.-J. Niedernostheide, H.-J. Schulze, B. Brunner, "600 V Reverse Conducting (RC-) IGBT for Drives Applications in Ultra-Thin Wafer Technology," Proc. ISPSD, 2007, pp. 89-92.
    • (2007) Proc. ISPSD , pp. 89-92
    • Ruething, H.1    Hille, F.2    Niedernostheide, F.-J.3    Schulze, H.-J.4    Brunner, B.5
  • 11
    • 51549106279 scopus 로고    scopus 로고
    • Experimental study of a 6.5 kV MOS controllable freewheeling diode
    • J.G. Bauer, T. Duetemeyer, F. Hille, O. Humbel, "Experimental Study of a 6.5 kV MOS Controllable Freewheeling Diode," Proc. ISPSD, 2008, pp. 40-44.
    • (2008) Proc. ISPSD , pp. 40-44
    • Bauer, J.G.1    Duetemeyer, T.2    Hille, F.3    Humbel, O.4
  • 12
    • 79953734725 scopus 로고    scopus 로고
    • New semiconductor technologies challenge package and system setups
    • G. Miller, "New Semiconductor Technologies challenge Package and System Setups," Proc. CIPS, 2010.
    • (2010) Proc. CIPS
    • Miller, G.1
  • 13
    • 84982175371 scopus 로고    scopus 로고
    • Properties of a new PrimePACK™ IGBT module concept for optimized electrical and thermal interconnection to a modern converter environment
    • O. Schilling, M. Wölz, G. Borghoff, Th. Nübel, G. Bräker, C. Lübke, "Properties of a New PrimePACK™ IGBT Module Concept for Optimized Electrical and Thermal Interconnection to a Modern Converter Environment," Proc. PCIM, 2005.
    • (2005) Proc. PCIM
    • Schilling, O.1    Wölz, M.2    Borghoff, G.3    Nübel, Th.4    Bräker, G.5    Lübke, C.6


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.