Reactive wetting in metal/metal systems: Dissolutive versus compound-forming systems

Materials Science and Engineering: A

Volumn 495, Issue 1-2, 2008, Pages 80-89

  Yin, Liang ^a   Chauhan, Anjali ^a   Singler, Timothy J ^a  

^a State University of New York   (United States)

Author keywords

Dissolution; Intermetallic compound; Reactive wetting; Thin film coatings; Triple line

Indexed keywords

BINARY ALLOYS; BISMUTH COMPOUNDS; DISSOLUTION; DROPS; PHASE INTERFACES; SUBSTRATES; TIN ALLOYS; TIN COMPOUNDS; WETTING;

COMPOUND FORMATION; FORMING SYSTEMS; INTERMETALLICS COMPOUNDS; METAL SYSTEMS; MOLTEN PHASIS; REACTIVE WETTING; SIMPLE++; SOLID SUBSTRATES; THIN FILMS - COATINGS; TRIPLE LINES;

INTERMETALLICS;

EID: 50949083782     PISSN: 09215093     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.msea.2007.11.097     Document Type: Article

References (20)

1. Klein Wassink R.J. Soldering in Electronics (1989), Electrochemical Pub., Isle of Man, British Isles
2. Yost F.G., and O'Toole E.J. Acta Mater. 46 (1998) 5143
3. Yin L., Murray B.T., and Singler T.J. Acta Mater. 54 (2006) 3561
4. Warren J.A., Boettinger W.J., and Roosen A.R. Acta Mater. 46 (1998) 3247
5. Yin L., Meschter S.J., and Singler T.J. Acta Mater. 52 (2004) 2873
6. L. Yin, Reactive wetting and spreading in binary metallic systems, PhD Thesis, Binghamton University, Binghamton (NY), 2005.
7. Eustathopoulos N. Acta Mater. 46 (1998) 2319
8. Lord R.A., and Umantsev A. J. Appl. Phys. 98 (2005) 063525
9. Be'er A., Hecht I., and Teitelbaum H. Phys. Rev. E 72 (2005) 031606
10. Landry K., and Eustathopoulos N. Acta Mater. 44 (1996) 3923
11. Mortensen A., Drevet B., and Eustathopoulos N. Scr. Mater. 36 (1997) 645
12. Massalski T.B. Binary Alloy Phase Diagrams (1990), ASM International Press, Ohio
13. Ciulik J., and Notis M.R. J. Alloys Compd. 191 (1993) 71
14. Q. Yang, Modeling and characterization for small-scale packaging applications, PhD Thesis, Binghamton University, Binghamton (NY), 2004.
15. Singler T.J., Meschter S.J., and Splik J. In: Puttliz K.J., and Stalter K.A. (Eds). Handbook of Lead-Free Solder Technology for Microelectronic Assemblies (2004), Marcel Dekker 331
16. L. Yin, T. Gosselin, unpublished results.
17. Plawsky J.L. Transport Phenomena Fundamentals (2001), Marcel Dekker 922
18. Jacinto C., et al. J. Non-Cryst. Solids 352 (2006) 3582
19. Moon K.W., Boettinger W.J., Kattner U.R., et al. J. Electron. Mater. 29 (2000) 1122
20. Karlsen O.B., Kjekshus A., and Rost E. Acta Chem. Scand. 46 (1992) 147