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Volumn 10, Issue 6, 2008, Pages 539-546

The optimal grain sized nanocrystalline ni with high strength and good ductility fabricated by a direct current electrodeposition

(4) Shen, Xixun a Lian, Jianshe a Jiang, Zhonghao a Jiang, Qing a

a JILIN UNIVERSITY (China)

Author keywords

[No Author keywords available]

Indexed keywords

AGRICULTURAL PRODUCTS; CONCENTRATION (PROCESS); COPPER PLATING; CURRENT DENSITY; DUCTILITY; ELECTRODEPOSITION; EPITAXIAL GROWTH; GRAIN (AGRICULTURAL PRODUCT); GRAIN SIZE AND SHAPE; MECHANICAL PROPERTIES; METALLIZING; NICKEL; NICKEL ALLOYS; OPTICAL DESIGN;

CONCENTRATION (COMPOSITION); DEFORMATION BEHAVIORS; DIRECT CURRENT (DC); DIRECT CURRENT ELECTRODEPOSITION; FINE GRAINED; GRAIN SIZE DEPENDENCE; GRAIN SIZES; HIGH STRENGTH; HIGH-CURRENT-DENSITY (HCD); NANO CRYSTALLINE; NANO SCALING; NUCLEATION RATES; STRENGTH (IGC: D5/D6); TRANSITION (JEL CLASSIFICATIONS:E52 ,E41 ,E31); VARIATIONS OF;

GRAIN GROWTH;

EID: 47349124260 PISSN: 14381656 EISSN: 15272648 Source Type: Journal
DOI: 10.1002/adem.200800009 Document Type: Article

Times cited : (35)

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