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Volumn 21, Issue 7, 2010, Pages 730-736
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Specific contact resistance and metallurgical process of the silverbased paste for making ohmic contact structure on the porous silicon/p-Si surface of the silicon solar cell
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Author keywords
[No Author keywords available]
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Indexed keywords
ADVERSE EFFECT;
AIR AMBIENT;
BARRIER PROPERTIES;
CONTACT STRUCTURE;
ELECTRICAL PROPERTY;
HIGH TEMPERATURE;
IN-DIFFUSION;
INTERFACIAL MORPHOLOGIES;
METAL CONTACTS;
METALIZATIONS;
METALLIZATIONS;
METALLURGICAL PROCESS;
OPTOELECTRONIC MATERIALS;
PERFECT CONTACT;
POROUS SILICON STRUCTURES;
POROUS SILICON SURFACES;
SCREEN-PRINTED;
SEM;
SI SURFACES;
SILICON SURFACES;
SINTERING PROCESS;
SINTERING TEMPERATURES;
SPECIFIC CONTACT RESISTANCES;
THREE ORDERS OF MAGNITUDE;
CONTACT RESISTANCE;
ELECTRIC PROPERTIES;
FIRE RESISTANCE;
METALLURGY;
METALS;
OHMIC CONTACTS;
OPTOELECTRONIC DEVICES;
SILICON SOLAR CELLS;
SILVER;
SINTERING;
SOLAR CELLS;
SURFACES;
POROUS SILICON;
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EID: 77955575624
PISSN: 09574522
EISSN: 1573482X
Source Type: Journal
DOI: 10.1007/s10854-009-9986-0 Document Type: Article |
Times cited : (11)
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References (40)
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