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Volumn 21, Issue 7, 2010, Pages 730-736

Specific contact resistance and metallurgical process of the silverbased paste for making ohmic contact structure on the porous silicon/p-Si surface of the silicon solar cell

Author keywords

[No Author keywords available]

Indexed keywords

ADVERSE EFFECT; AIR AMBIENT; BARRIER PROPERTIES; CONTACT STRUCTURE; ELECTRICAL PROPERTY; HIGH TEMPERATURE; IN-DIFFUSION; INTERFACIAL MORPHOLOGIES; METAL CONTACTS; METALIZATIONS; METALLIZATIONS; METALLURGICAL PROCESS; OPTOELECTRONIC MATERIALS; PERFECT CONTACT; POROUS SILICON STRUCTURES; POROUS SILICON SURFACES; SCREEN-PRINTED; SEM; SI SURFACES; SILICON SURFACES; SINTERING PROCESS; SINTERING TEMPERATURES; SPECIFIC CONTACT RESISTANCES; THREE ORDERS OF MAGNITUDE;

EID: 77955575624     PISSN: 09574522     EISSN: 1573482X     Source Type: Journal    
DOI: 10.1007/s10854-009-9986-0     Document Type: Article
Times cited : (11)

References (40)


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.