Micron-sized fracture experiments on amorphous SiOx films and SiOx/SiNx multi-layers

Thin Solid Films

Volumn 518, Issue 20, 2010, Pages 5796-5801

  Matoy, Kurt ^a,b,c   Schönherr, Helmut ^d   Detzel, Thomas ^d   Dehm, Gerhard ^b,c  

^a Kompetenzzentrum Automobil und Industrie Elektronik Gmbh   (Austria)

^b ERICH SCHMID INSTITUTE OF MATERIALS SCIENCE   (Austria)

^c UNIVERSITY OF LEOBEN   (Austria)

^d INFINEON TECHNOLOGIES AUSTRIA AG   (Austria)

Author keywords

Micro cantilever; Multi layer; Silicon nitride; Silicon oxide

Indexed keywords

BENDING EXPERIMENTS; CHEMICAL VAPOR DEPOSITED; FRACTURE STRESS; LAYER THICKNESS; MICRO-CANTILEVERS; MONOLITHIC MATERIAL; MULTILAYER STACKS; STRENGTH VALUES;

AMORPHOUS FILMS; ATOMIC FORCE MICROSCOPY; BRITTLE FRACTURE; EPITAXIAL GROWTH; FOCUSED ION BEAMS; NANOCANTILEVERS; SILICON NITRIDE; SILICON OXIDES; TENSILE STRENGTH;

FRACTURE TOUGHNESS;

EID: 77955425218     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/j.tsf.2010.05.114     Document Type: Conference Paper

References (13)

1. Handbook of Multilevel Metallization for Integrated Circuits 1993 Noyes Publications New Jersey
2. T. Tsuchiya, A. Inoue, and J. Sakata Sens. Actuators, A: Phys. 82 2000 286
3. T. Yoshioka, T. Ando, M. Shikida, and K. Sato Sens. Actuators, A: Phys. 82 2000 291
4. J.L. Yang, J. Gaspar, and O. Paul J. Microelectromech. Syst. 17 2008 1120
5. T. Namazu, and Y. Iosono Sens. Actuators, A 104/1 2003 78
6. K. Matoy, H. Schönherr, T. Detzel, T. Schöberl, R. Pippan, C. Motz, and G. Dehm Thin Solid Films 518/1 2009 247
7. T.P. Weihs, S. Hong, J.C. Bravman, and W.D. Nix J. Mater. Res. 3/5 1988 931
8. W. Zhou, J. Yang, Y. Li, A. Ji, F. Yang, and Y. Yu Thin Solid Films 517 2009 1989
9. G.F. Cardinale, and R.W. Tustison Thin Solid Films 207/1-2 1992 126
10. Y.-J. Su, C.-F. Qian, M.-H. Zhao, and T.-Y. Zhang Acta Mater. 48 2000 4901
11. D. DiMaio, and S.G. Roberts J. Mater. Res. 20 2005 299
12. T.H. Courtney Mechanical Behavior of Materials 2000 McGraw-Hill Boston
13. W.C. Oliver, and G.M. Pharr J. Mater. Res. 7/6 1992 1564