Manifold microchannel heat sinks: Isothermal analysis

Thermal Phenomena in Electronic Systems -Proceedings of the Intersociety Conference

Volumn , Issue , 1996, Pages 251-257

  Copeland, David ^a   Behnia, Masud ^a   Nakayama, Wataru ^a  

^a TOKYO INSTITUTE OF TECHNOLOGY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CHANNEL FLOW; COMPUTATIONAL FLUID DYNAMICS; COMPUTER SIMULATION; COOLING; ELECTRONICS PACKAGING; FINITE VOLUME METHOD; FLOW MEASUREMENT; FLUOROCARBONS; HEAT TRANSFER; MULTICHIP MODULES;

MANIFOLD MICROCHANNEL HEAT SINKS;

HEAT SINKS;

EID: 0029712596     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (9)