Electromigration simulation for metal lines

Journal of Electronic Packaging

Volumn 132, Issue 1, 2010, Pages 0110021-0110027

  Jing, Jianping ^a   Liang, Lihua ^b   Meng, Guang ^a  

^a SHANGHAI JIAO TONG UNIVERSITY   (China)

^b ZHEJIANG UNIVERSITY OF TECHNOLOGY   (China)

Author keywords

[No Author keywords available]

Indexed keywords

ATOMS; COMPUTER SOFTWARE; FORTRAN (PROGRAMMING LANGUAGE); NUMERICAL METHODS;

ATOMIC CONCENTRATION; CONCENTRATION- GRADIENTS; ELECTROMIGRATION FAILURES; ELECTRONIC INDUSTRIES; FORTRAN CODE; HIGH CURRENT DENSITIES; IC INTERCONNECT; METAL LINE; MINIATURISATION; PERFORMANCE;

ELECTROMIGRATION;

EID: 77955264867     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.4000716     Document Type: Article

References (19)

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